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- Chemical compounds
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  - Diffusion
    - Electromigration (1)
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ELECTROMIGRATION, STRESS AND RELIABILITY IN 3D STRUCTURES (1)

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Journal Articles

Modeling of microstructural effects on electromigration failure

H. Ceric, R. L. de Orio, W. Zisser, S. Selberherr

Journal: AIP Conference Proceedings

AIP Conf. Proc. 1601, 99–113 (2014)

https://doi.org/10.1063/1.4881344

Published: June 2014

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