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Valeriy Sukharev
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Journal Articles

Novel physics-based tool-prototype for electromigration assessment in commercial-grade power delivery networks

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Sofya Torosyan, Armen Kteyan, Valeriy Sukharev, Jun-Ho Choy, Farid N. Najm
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 39, 013203 (2021)
https://doi.org/10.1116/6.0000617
Published: December 2020
View articletitled, Novel physics-based tool-prototype for electromigration assessment in commercial-grade power delivery networks
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Journal Articles

Advanced methodology for assessing chip package interaction effects on chip performance and reliability after chip assembly and during chip operation

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Jun-Ho Choy, Valeriy Sukharev, Armen Kteyan
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 38, 063205 (2020)
https://doi.org/10.1116/6.0000506
Published: October 2020
View articletitled, Advanced methodology for assessing chip package interaction effects on chip performance and reliability after chip assembly and during chip operation
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Journal Articles

Electromigration simulation and design considerations for integrated circuit power grids

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Farid N. Najm, Valeriy Sukharev
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 38, 063204 (2020)
https://doi.org/10.1116/6.0000476
Published: October 2020
View articletitled, Electromigration simulation and design considerations for integrated circuit power grids
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Journal Articles

Preface: Stress-Induced Phenomena and Reliability in 3D Microelectronics

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Paul S. Ho, Chao-Kun Hu, Mark Nakamoto, Shinichi Ogawa, Larry Smith, Valeriy Sukharev, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 1–2 (2014)
https://doi.org/10.1063/1.4881337
Published: June 2014
View articletitled, Preface: Stress-Induced Phenomena and Reliability in 3D Microelectronics
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Journal Articles

Physics-based simulation of EM and SM in TSV-based 3D IC structures

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Armen Kteyan, Valeriy Sukharev, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 114–127 (2014)
https://doi.org/10.1063/1.4881345
Published: June 2014
View articletitled, Physics-based simulation of EM and SM in TSV-based 3D IC structures
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Journal Articles

Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies – Effect of stress on 3D IC interconnect reliability

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Valeriy Sukharev, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 18–54 (2014)
https://doi.org/10.1063/1.4881339
Published: June 2014
View articletitled, Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies – Effect of stress on 3D IC interconnect reliability
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Journal Articles

PREFACE

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Ehrenfried Zschech, Riko Radojcic, Valeriy Sukharev, Larry Smith
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1378, 1 (2011)
https://doi.org/10.1063/1.3615692
Published: September 2011
View articletitled, PREFACE
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Journal Articles

Multi‐Scale Environment For Simulation And Materials Characterization In Stress Management For 3D IC TSV‐Based Technologies—Effect Of Stress On The Device Characteristics

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Valeriy Sukharev, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1378, 21–49 (2011)
https://doi.org/10.1063/1.3615694
Published: September 2011
View articletitled, Multi‐Scale Environment For Simulation And Materials Characterization In Stress Management For 3D IC TSV‐Based Technologies—Effect Of Stress On The Device Characteristics
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Journal Articles

3D IC TSV‐Based Technology: Stress Assessment For Chip Performance

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Valeriy Sukharev, Armen Kteyan, Nikolay Khachatryan, Henrik Hovsepyan, Juan Andres Torres, Jun‐Ho Choy, Ara Markosian
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 202–213 (2010)
https://doi.org/10.1063/1.3527127
Published: November 2010
View articletitled, 3D IC TSV‐Based Technology: Stress Assessment For Chip Performance
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Journal Articles

Design specific variation in via/contact pattern transfer: Full chip analysis

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Jun-Ho Choy, Valeriy Sukharev, Ara Markosian, Armen Kteyan, Yuri Granik, Vladimir Bliznetsov
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 27, 2962–2971 (2009)
https://doi.org/10.1116/1.3253535
Published: December 2009
View articletitled, Design specific variation in via/contact pattern transfer: Full chip analysis
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Journal Articles

Low‐k Material Characterization with High Spatial Resolution: k Value and E Modulus

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Ehrenfried Zschech, Pavel Potapov, Dmytro Chumakov, Hans‐Juergen Engelmann, Holm Geisler, Valeriy Sukharev
Journal: AIP Conference Proceedings
AIP Conf. Proc. 945, 142–151 (2007)
https://doi.org/10.1063/1.2815774
Published: October 2007
View articletitled, Low‐k Material Characterization with High Spatial Resolution: k Value and E Modulus
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Journal Articles

A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure

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Valeriy Sukharev, Ehrenfried Zschech, William D. Nix
Journal: Journal of Applied Physics
J. Appl. Phys. 102, 053505 (2007)
https://doi.org/10.1063/1.2775538
Published: September 2007
View articletitled, A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure
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Journal Articles

Physically Based Simulation of Electromigration‐Induced Degradation of Inlaid Copper Interconnects

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Valeriy Sukharev
Journal: AIP Conference Proceedings
AIP Conf. Proc. 741, 85–96 (2004)
https://doi.org/10.1063/1.1845839
Published: December 2004
View articletitled, Physically Based Simulation of Electromigration‐Induced Degradation of Inlaid Copper Interconnects
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Journal Articles

A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of interface bonding strength

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Valeriy Sukharev, Ehrenfried Zschech
Journal: Journal of Applied Physics
J. Appl. Phys. 96, 6337–6343 (2004)
https://doi.org/10.1063/1.1805188
Published: December 2004
View articletitled, A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of interface bonding strength
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Journal Articles

Integrated multiscale three-dimensional simulation approach in local interconnect gap-fill optimization

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Valeriy Sukharev, Kiran Kumar, Weidan Li, Joe Zhao, Wolfgang Pyka, E. Jack McInerney, Sooyun Joh
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 19, 1879–1893 (2001)
https://doi.org/10.1116/1.1403444
Published: September 2001
View articletitled, Integrated multiscale three-dimensional simulation approach in local interconnect gap-fill optimization
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Journal Articles

Analytical modeling of silicon etch process in high density plasma

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Shahram Abdollahi-Alibeik, James P. McVittie, Krishna C. Saraswat, Valeriy Sukharev, Philippe Schoenborn
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 17, 2485–2491 (1999)
https://doi.org/10.1116/1.581986
Published: September 1999
View articletitled, Analytical modeling of silicon etch process in high density plasma
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Journal Articles

Plasma-induced nitridation of gate oxide dielectrics: Linked equipment-feature atomic scale simulations

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Valeriy Sukharev, Sheldon Aronowitz, Vladimir Zubkov, Helmut Puchner, John Haywood, Jim Kimball
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 17, 1356–1363 (1999)
https://doi.org/10.1116/1.581820
Published: July 1999
View articletitled, Plasma-induced nitridation of gate oxide dielectrics: Linked equipment-feature atomic scale simulations
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Journal Articles

Microtrenching resulting from specular reflection during chlorine etching of silicon

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Robert J. Hoekstra, Mark J. Kushner, Valeriy Sukharev, Phillipe Schoenborn
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 16, 2102–2104 (1998)
https://doi.org/10.1116/1.590135
Published: July 1998
View articletitled, Microtrenching resulting from specular reflection during chlorine etching of silicon
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