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Journal Articles

Plasma sources for advanced semiconductor applications

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Oscar Versolato, Igor Kaganovich, Kallol Bera, Thorsten Lill, Hyo-Chang Lee, Ronnie Hoekstra, John Sheil, Sang Ki Nam
Journal: Applied Physics Letters
Appl. Phys. Lett. 125, 230401 (2024)
https://doi.org/10.1063/5.0247819
Published: December 2024
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Journal Articles

Low-temperature etching of silicon oxide and silicon nitride with hydrogen fluoride

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Thorsten Lill, Mingmei Wang, Dongjun Wu, Youn-Jin Oh, Tae Won Kim, Mark Wilcoxson, Harmeet Singh, Vahid Ghodsi, Steven M. George, Yuri Barsukov, Igor Kaganovich
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 42, 063006 (2024)
https://doi.org/10.1116/6.0004019
Published: November 2024
View articletitled, Low-temperature etching of silicon oxide and silicon nitride with hydrogen fluoride
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Journal Articles

Future of plasma etching for microelectronics: Challenges and opportunities

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Gottlieb S. Oehrlein, Stephan M. Brandstadter, Robert L. Bruce, Jane P. Chang, Jessica C. DeMott, Vincent M. Donnelly, Rémi Dussart, Andreas Fischer, Richard A. Gottscho, Satoshi Hamaguchi, Masanobu Honda, Masaru Hori, Kenji Ishikawa, Steven G. Jaloviar, Keren J. Kanarik, Kazuhiro Karahashi, Akiteru Ko, Hiten Kothari, Nobuyuki Kuboi, Mark J. Kushner, Thorsten Lill, Pingshan Luan, Ali Mesbah, Eric Miller, Shoubhanik Nath, Yoshinobu Ohya, Mitsuhiro Omura, Chanhoon Park, John Poulose, Shahid Rauf, Makoto Sekine, Taylor G. Smith, Nathan Stafford, Theo Standaert, Peter L. G. Ventzek
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 041501 (2024)
https://doi.org/10.1116/6.0003579
Published: June 2024
View articletitled, Future of plasma etching for microelectronics: Challenges and opportunities
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Journal Articles

Plasma application in atomic layer etching

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Andreas Fischer, Thorsten Lill
Journal: Physics of Plasmas
Phys. Plasmas 30, 080601 (2023)
https://doi.org/10.1063/5.0158785
Published: August 2023
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Journal Articles

Neutral transport during etching of high aspect ratio features

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Theodoros Panagopoulos, Thorsten Lill
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 41, 033006 (2023)
https://doi.org/10.1116/6.0002468
Published: April 2023
View articletitled, Neutral transport during etching of high aspect ratio features
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Journal Articles

Dry etching in the presence of physisorption of neutrals at lower temperatures

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Thorsten Lill, Ivan L. Berry, Meihua Shen, John Hoang, Andreas Fischer, Theo Panagopoulos, Jane P. Chang, Vahid Vahedi
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 41, 023005 (2023)
https://doi.org/10.1116/6.0002230
Published: February 2023
View articletitled, Dry etching in the presence of physisorption of neutrals at lower temperatures
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Journal Articles

Surface reaction modelling of thermal atomic layer etching on blanket hafnium oxide and its application on high aspect ratio structures

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Andreas Fischer, David Mui, Aaron Routzahn, Ryan Gasvoda, Jim Sims, Thorsten Lill
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 41, 012601 (2023)
https://doi.org/10.1116/6.0002244
Published: December 2022
View articletitled, Surface reaction modelling of thermal atomic layer etching on blanket hafnium oxide and its application on high aspect ratio structures
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Journal Articles

Control of etch profiles in high aspect ratio holes via precise reactant dosing in thermal atomic layer etching

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Andreas Fischer, Aaron Routzahn, Ryan J. Gasvoda, Jim Sims, Thorsten Lill
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 40, 022603 (2022)
https://doi.org/10.1116/6.0001691
Published: February 2022
View articletitled, Control of etch profiles in high aspect ratio holes via precise reactant dosing in thermal atomic layer etching
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Journal Articles

Thermal atomic layer etching: A review

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Andreas Fischer, Aaron Routzahn, Steven M. George, Thorsten Lill
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 39, 030801 (2021)
https://doi.org/10.1116/6.0000894
Published: March 2021
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Journal Articles

Review on recent progress in patterning phase change materials

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Meihua Shen, Thorsten Lill, Nick Altieri, John Hoang, Steven Chiou, Jim Sims, Andrew McKerrow, Rafal Dylewicz, Ernest Chen, Hamid Razavi, Jane P. Chang
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 38, 060802 (2020)
https://doi.org/10.1116/6.0000336
Published: September 2020
View articletitled, Review on recent progress in patterning phase change materials
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Journal Articles

Causes of anisotropy in thermal atomic layer etching of nanostructures

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Andreas Fischer, Aaron Routzahn, Sandy Wen, Thorsten Lill
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 38, 042601 (2020)
https://doi.org/10.1116/6.0000261
Published: June 2020
View articletitled, Causes of anisotropy in thermal atomic layer etching of nanostructures
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Journal Articles

Thermal etching of AlF3 and thermal atomic layer etching of Al2O3

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Andreas Fischer, Aaron Routzahn, Younghee Lee, Thorsten Lill, Steven M. George
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 38, 022603 (2020)
https://doi.org/10.1116/1.5135911
Published: January 2020
View articletitled, Thermal etching of AlF3 and thermal atomic layer etching of Al2O3
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Journal Articles

Applying sputtering theory to directional atomic layer etching

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Ivan L. Berry, Keren J. Kanarik, Thorsten Lill, Samantha Tan, Vahid Vahedi, Richard A. Gottscho
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 36, 01B105 (2018)
https://doi.org/10.1116/1.5003393
Published: December 2017
View articletitled, Applying sputtering theory to directional atomic layer etching
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Journal Articles

Directional etch of magnetic and noble metals. I. Role of surface oxidation states

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Jack Kun-Chieh Chen, Nicholas D. Altieri, Taeseung Kim, Thorsten Lill, Meihua Shen, Jane P. Chang
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 35, 05C304 (2017)
https://doi.org/10.1116/1.4983829
Published: May 2017
View articletitled, Directional etch of magnetic and noble metals. I. Role of surface oxidation states
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Journal Articles

Directional etch of magnetic and noble metals. II. Organic chemical vapor etch

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Jack Kun-Chieh Chen, Nicholas D. Altieri, Taeseung Kim, Ernest Chen, Thorsten Lill, Meihua Shen, Jane P. Chang
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 35, 05C305 (2017)
https://doi.org/10.1116/1.4983830
Published: May 2017
View articletitled, Directional etch of magnetic and noble metals. II. Organic chemical vapor etch
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Journal Articles

Predicting synergy in atomic layer etching

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Keren J. Kanarik, Samantha Tan, Wenbing Yang, Taeseung Kim, Thorsten Lill, Alexander Kabansky, Eric A. Hudson, Tomihito Ohba, Kazuo Nojiri, Jengyi Yu, Rich Wise, Ivan L. Berry, Yang Pan, Jeffrey Marks, Richard A. Gottscho
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 35, 05C302 (2017)
https://doi.org/10.1116/1.4979019
Published: March 2017
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Journal Articles

Overview of atomic layer etching in the semiconductor industry

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Keren J. Kanarik, Thorsten Lill, Eric A. Hudson, Saravanapriyan Sriraman, Samantha Tan, Jeffrey Marks, Vahid Vahedi, Richard A. Gottscho
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 33, 020802 (2015)
https://doi.org/10.1116/1.4913379
Published: March 2015
View articletitled, Overview of atomic layer etching in the semiconductor industry
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Journal Articles

SiCl4/Cl2 plasmas: A new chemistry to etch high-k materials selectively to Si-based materials

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Paul Bodart, Gilles Cunge, Olivier Joubert, Thorsten Lill
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 30, 020602 (2012)
https://doi.org/10.1116/1.3679551
Published: February 2012
View articletitled, SiCl4/Cl2 plasmas: A new chemistry to etch high-k materials selectively to Si-based materials
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Journal Articles

Reducing damage to Si substrates during gate etching processes by synchronous plasma pulsing

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Camille Petit-Etienne, Maxime Darnon, Laurent Vallier, Erwine Pargon, Gilles Cunge, François Boulard, Olivier Joubert, Samer Banna, Thorsten Lill
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 28, 926–934 (2010)
https://doi.org/10.1116/1.3483165
Published: August 2010
View articletitled, Reducing damage to Si substrates during gate etching processes by synchronous plasma pulsing
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Journal Articles

Mass spectrometry studies of resist trimming processes in H Br ∕ O 2 and Cl 2 ∕ O 2 chemistries

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E. Pargon, O. Joubert, T. Chevolleau, G. Cunge, Songlin Xu, Thorsten Lill
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 23, 103–112 (2005)
https://doi.org/10.1116/1.1839915
Published: January 2005
View articletitled, Mass spectrometry studies of resist trimming processes in H Br ∕ O 2 and Cl 2 ∕ O 2 chemistries
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