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Journal Articles

Second-harmonic microscopy of strain fields around through-silicon-vias

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Yujin Cho, Farbod Shafiei, B. S. Mendoza, Ming Lei, Tengfei Jiang, P. S. Ho, M. C. Downer
Journal: Applied Physics Letters
Appl. Phys. Lett. 108, 151602 (2016)
https://doi.org/10.1063/1.4946773
Published: April 2016
View articletitled, Second-harmonic microscopy of strain fields around through-silicon-vias
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Includes: Supplementary data
Journal Articles

Thermomechanical characterization and modeling for TSV structures

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Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Jay Im, Paul S. Ho, Rui Huang
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 148–157 (2014)
https://doi.org/10.1063/1.4881348
Published: June 2014
View articletitled, Thermomechanical characterization and modeling for TSV structures
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Journal Articles

Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration

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Tengfei Jiang, Suk-Kyu Ryu, Jay Im, Rui Huang, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 55–66 (2014)
https://doi.org/10.1063/1.4881340
Published: June 2014
View articletitled, Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration
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Journal Articles

Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects

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Tengfei Jiang, Chenglin Wu, Laura Spinella, Jay Im, Nobumichi Tamura, Martin Kunz, Ho-Young Son, Byoung Gyu Kim, Rui Huang, Paul S. Ho
Journal: Applied Physics Letters
Appl. Phys. Lett. 103, 211906 (2013)
https://doi.org/10.1063/1.4833020
Published: November 2013
View articletitled, Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects
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Journal Articles

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

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Suk-Kyu Ryu, Tengfei Jiang, Kuan H. Lu, Jay Im, Ho-Young Son, Kwang-Yoo Byun, Rui Huang, Paul S. Ho
Journal: Applied Physics Letters
Appl. Phys. Lett. 100, 041901 (2012)
https://doi.org/10.1063/1.3678020
Published: January 2012
View articletitled, Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique
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