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Journal Articles

Design for reliability of BEoL and 3-D TSV structures – A joint effort of FEA and innovative experimental techniques

Jürgen Auersperg, Dietmar Vogel, Ellen Auerswald, Sven Rzepka, Bernd Michel

AIP Conf. Proc. 1601, 138–147 (2014)

https://doi.org/10.1063/1.4881347

Published: June 2014

View articletitled, Design for reliability of BEoL and 3-D TSV structures – A joint effort of FEA and innovative experimental techniques

Journal Articles

A finite element study of thermal stress in copper interconnect

Peng Su, Sven Rzepka, Matt A. Korhonen, Che-Yu Li

AIP Conf. Proc. 491, 298–303 (1999)

https://doi.org/10.1063/1.59920

Published: November 1999

View articletitled, A finite element study of thermal stress in copper interconnect