1-7 of 7
Suk-Kyu Ryu
Close
Save search
Follow your search
Access your saved searches in your account
Close Modal
Sort by
Journal Articles

Thermomechanical characterization and modeling for TSV structures

Available to Purchase
Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Jay Im, Paul S. Ho, Rui Huang
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 148–157 (2014)
https://doi.org/10.1063/1.4881348
Published: June 2014
View articletitled, Thermomechanical characterization and modeling for TSV structures
Open the PDF for Thermomechanical characterization and modeling for TSV structures in another window
Journal Articles

Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration

Available to Purchase
Tengfei Jiang, Suk-Kyu Ryu, Jay Im, Rui Huang, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 55–66 (2014)
https://doi.org/10.1063/1.4881340
Published: June 2014
View articletitled, Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration
Open the PDF for Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration in another window
Journal Articles

Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects

Available to Purchase
Suk-Kyu Ryu, Qiu Zhao, Michael Hecker, Ho-Young Son, Kwang-Yoo Byun, Jay Im, Paul S. Ho, Rui Huang
Journal: Journal of Applied Physics
J. Appl. Phys. 111, 063513 (2012)
https://doi.org/10.1063/1.3696980
Published: March 2012
View articletitled, Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects
Open the PDF for Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects in another window
Journal Articles

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Available to Purchase
Suk-Kyu Ryu, Tengfei Jiang, Kuan H. Lu, Jay Im, Ho-Young Son, Kwang-Yoo Byun, Rui Huang, Paul S. Ho
Journal: Applied Physics Letters
Appl. Phys. Lett. 100, 041901 (2012)
https://doi.org/10.1063/1.3678020
Published: January 2012
View articletitled, Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique
Open the PDF for Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique in another window
Journal Articles

Stress‐Induced Delamination Of Through Silicon Via Structures

Available to Purchase
Suk‐Kyu Ryu, Kuan‐Hsun Lu, Jay Im, Rui Huang, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1378, 153–167 (2011)
https://doi.org/10.1063/1.3615702
Published: September 2011
View articletitled, Stress‐Induced Delamination Of Through Silicon Via Structures
Open the PDF for Stress‐Induced Delamination Of Through Silicon Via Structures in another window
Journal Articles

Thermomechanical Reliability Challenges For 3D Interconnects With Through‐Silicon Vias

Available to Purchase
Suk‐Kyu Ryu, Kuan‐Hsun Lu, Xuefeng Zhang, Jay Im, Paul S. Ho, Rui Huang
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 189–200 (2010)
https://doi.org/10.1063/1.3527126
Published: November 2010
View articletitled, Thermomechanical Reliability Challenges For 3D Interconnects With Through‐Silicon Vias
Open the PDF for Thermomechanical Reliability Challenges For 3D Interconnects With Through‐Silicon Vias in another window
Journal Articles

Thermal Stresses Analysis of 3‐D Interconnect

Available to Purchase
Kuan H. Lu, Xuefeng Zhang, Suk‐Kyu Ryu, Rui Huang, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 224–230 (2009)
https://doi.org/10.1063/1.3169263
Published: June 2009
View articletitled, Thermal Stresses Analysis of 3‐D Interconnect
Open the PDF for Thermal Stresses Analysis of 3‐D Interconnect in another window