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Journal Articles

Magnetic field imaging by hBN quantum sensor nanoarray

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Kento Sasaki, Yuki Nakamura, Hao Gu, Moeta Tsukamoto, Shu Nakaharai, Takuya Iwasaki, Kenji Watanabe, Takashi Taniguchi, Shinichi Ogawa, Yukinori Morita, Kensuke Kobayashi
Journal: Applied Physics Letters
Appl. Phys. Lett. 122, 244003 (2023)
https://doi.org/10.1063/5.0147072
Published: June 2023
View articletitled, Magnetic field imaging by hBN quantum sensor nanoarray
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Journal Articles

Conductivity change of defective graphene by helium ion beams

Open Access
Yuichi Naitou, Shinichi Ogawa
Journal: AIP Advances
AIP Advances 7, 045203 (2017)
https://doi.org/10.1063/1.4979983
Published: April 2017
View articletitled, Conductivity change of defective graphene by helium ion beams
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Journal Articles

Tomographic measurement of buried interface roughness

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Misa Hayashida, Shinichi Ogawa, Marek Malac
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 33, 040605 (2015)
https://doi.org/10.1116/1.4926975
Published: July 2015
View articletitled, Tomographic measurement of buried interface roughness
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Journal Articles

Preface: Stress-Induced Phenomena and Reliability in 3D Microelectronics

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Paul S. Ho, Chao-Kun Hu, Mark Nakamoto, Shinichi Ogawa, Larry Smith, Valeriy Sukharev, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 1–2 (2014)
https://doi.org/10.1063/1.4881337
Published: June 2014
View articletitled, Preface: Stress-Induced Phenomena and Reliability in 3D Microelectronics
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Journal Articles

Tungsten-based pillar deposition by helium ion microscope and beam-induced substrate damage

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Kazuyuki Kohama, Tomohiko Iijima, Misa Hayashida, Shinichi Ogawa
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 31, 031802 (2013)
https://doi.org/10.1116/1.4800983
Published: April 2013
View articletitled, Tungsten-based pillar deposition by helium ion microscope and beam-induced substrate damage
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Journal Articles

Low-resistivity atomic-layer-deposited- TaN with atomic-layer-deposited- TaN /physical-vapor-deposited-Ta multilayer structure for multilevel Cu damascene interconnect

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Akira Furuya, Nobuyuki Ohtsuka, Naofumi Ohashi, Seiichi Kondo, Shinichi Ogawa
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 24, 103–105 (2006)
https://doi.org/10.1116/1.2137332
Published: December 2005
View articletitled, Low-resistivity atomic-layer-deposited- TaN with atomic-layer-deposited- TaN /physical-vapor-deposited-Ta multilayer structure for multilevel Cu damascene interconnect
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Journal Articles

Ultrathin pore-seal film by plasma enhanced chemical vapor deposition SiCH from tetramethylsilane

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Akira Furuya, Katsumi Yoneda, Eiichi Soda, Toru Yoshie, Hiroshi Okamura, Miyoko Shimada, Nobuyuki Ohtsuka, Shinichi Ogawa
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 23, 2522–2525 (2005)
https://doi.org/10.1116/1.2132324
Published: November 2005
View articletitled, Ultrathin pore-seal film by plasma enhanced chemical vapor deposition SiCH from tetramethylsilane
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Journal Articles

Ta penetration into template-type porous low- k material during atomic layer deposition of TaN

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Akira Furuya, Nobuyuki Ohtsuka, Kaori Misawa, Miyoko Shimada, Shinichi Ogawa
Journal: Journal of Applied Physics
J. Appl. Phys. 98, 094902 (2005)
https://doi.org/10.1063/1.2121937
Published: November 2005
View articletitled, Ta penetration into template-type porous low- k material during atomic layer deposition of TaN
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Journal Articles

Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition

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Akira Furuya, Hiroshi Tsuda, Shinichi Ogawa
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 23, 979–983 (2005)
https://doi.org/10.1116/1.1926289
Published: May 2005
View articletitled, Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition
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Journal Articles

Comparison of electromigration behavior in passivated aluminum interconnects

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Samantha Lee, Jonathan Doan, John C. Bravman, Paul A. Flinn, Thomas N. Marieb, Shinichi Ogawa
Journal: AIP Conference Proceedings
AIP Conf. Proc. 418, 101–106 (1998)
https://doi.org/10.1063/1.54632
Published: January 1998
View articletitled, Comparison of electromigration behavior in passivated aluminum interconnects
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Journal Articles

Time‐dependent p‐n junction characteristics underneath TiN/Ti contact metal

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Takehito Yoshida, Hiroyuki Kawahara, Shinichi Ogawa
Journal: Journal of Applied Physics
J. Appl. Phys. 76, 5272–5277 (1994)
https://doi.org/10.1063/1.357177
Published: November 1994
View articletitled, Time‐dependent p‐n junction characteristics underneath TiN/Ti contact metal
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Journal Articles

Anomalous behavior of shallow BF3 plasma immersion ion implantation

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Erin C. Jones, William En, Shinichi Ogawa, David B. Fraser, Nathan W. Cheung
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 12, 956–961 (1994)
https://doi.org/10.1116/1.587335
Published: March 1994
View articletitled, Anomalous behavior of shallow BF3 plasma immersion ion implantation
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