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S. M. Rossnagel
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Journal Articles

Deposition of aluminum-doped zinc oxide thin films for optical applications using rf and dc magnetron sputter deposition

Kousik Sivakumar, S. M. Rossnagel
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 28, 515–522 (2010)
https://doi.org/10.1116/1.3425640
Published: June 2010
View article titled, Deposition of aluminum-doped zinc oxide thin films for optical applications using rf and dc magnetron sputter deposition
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Journal Articles

Evidence for segregation of Te in Ge 2 Sb 2 Te 5 films: Effect on the “phase-change” stress

L. Krusin-Elbaum, C. Cabral, Jr., K. N. Chen, M. Copel, D. W. Abraham, K. B. Reuter, S. M. Rossnagel, J. Bruley, V. R. Deline
Journal: Applied Physics Letters
Appl. Phys. Lett. 90, 141902 (2007)
https://doi.org/10.1063/1.2719148
Published: April 2007
View article titled, Evidence for segregation of Te in Ge 2 Sb 2 Te 5 films: Effect on the “phase-change” stress
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Journal Articles

Robust Ta N x diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition

H. Kim, C. Detavenier, O. van der Straten, S. M. Rossnagel, A. J. Kellock, D.-G. Park
Journal: Journal of Applied Physics
J. Appl. Phys. 98, 014308 (2005)
https://doi.org/10.1063/1.1935761
Published: July 2005
View article titled, Robust Ta N x diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
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Journal Articles

The physical properties of cubic plasma-enhanced atomic layer deposition TaN films

H. Kim, C. Lavoie, M. Copel, V. Narayanan, D.-G. Park, S. M. Rossnagel
Journal: Journal of Applied Physics
J. Appl. Phys. 95, 5848–5855 (2004)
https://doi.org/10.1063/1.1704863
Published: May 2004
View article titled, The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
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Journal Articles

Alteration of Cu conductivity in the size effect regime

S. M. Rossnagel, T. S. Kuan
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 22, 240–247 (2004)
https://doi.org/10.1116/1.1642639
Published: January 2004
View article titled, Alteration of Cu conductivity in the size effect regime
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Journal Articles

Diffusion barrier properties of very thin TaN with high nitrogen concentration

S. M. Rossnagel, H. Kim
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 21, 2550–2554 (2003)
https://doi.org/10.1116/1.1625953
Published: November 2003
View article titled, Diffusion barrier properties of very thin TaN with high nitrogen concentration
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Journal Articles

Thin film deposition with physical vapor deposition and related technologies

S. M. Rossnagel
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 21, S74–S87 (2003)
https://doi.org/10.1116/1.1600450
Published: September 2003
View article titled, Thin film deposition with physical vapor deposition and related technologies
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Journal Articles

Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition

H. Kim, A. J. Kellock, S. M. Rossnagel
Journal: Journal of Applied Physics
J. Appl. Phys. 92, 7080–7085 (2002)
https://doi.org/10.1063/1.1519949
Published: December 2002
View article titled, Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
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Journal Articles

Characteristics of ultrathin Ta and TaN films

S. M. Rossnagel
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 20, 2328–2336 (2002)
https://doi.org/10.1116/1.1520556
Published: December 2002
View article titled, Characteristics of ultrathin Ta and TaN films
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Journal Articles

Time development of microstructure and resistivity for very thin Cu films

S. M. Rossnagel, T. S. Kuan
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 20, 1911–1915 (2002)
https://doi.org/10.1116/1.1507340
Published: November 2002
View article titled, Time development of microstructure and resistivity for very thin Cu films
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Journal Articles

Phase transformation of thin sputter-deposited tungsten films at room temperature

S. M. Rossnagel, I. C. Noyan, C. Cabral, Jr.
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 20, 2047–2051 (2002)
https://doi.org/10.1116/1.1506905
Published: October 2002
View article titled, Phase transformation of thin sputter-deposited tungsten films at room temperature
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Journal Articles

Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition

H. Kim, C. Cabral, Jr., C. Lavoie, S. M. Rossnagel
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 20, 1321–1326 (2002)
https://doi.org/10.1116/1.1486233
Published: August 2002
View article titled, Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
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Journal Articles

Growth kinetics and initial stage growth during plasma-enhanced Ti atomic layer deposition

H. Kim, S. M. Rossnagel
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 20, 802–808 (2002)
https://doi.org/10.1116/1.1469009
Published: May 2002
View article titled, Growth kinetics and initial stage growth during plasma-enhanced Ti atomic layer deposition
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Journal Articles

Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers

S. M. Rossnagel, A. Sherman, F. Turner
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 18, 2016–2020 (2000)
https://doi.org/10.1116/1.1305809
Published: July 2000
View article titled, Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers
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Journal Articles

Thermal stability and oxygen-loss characteristics of Pt(O) films prepared by reactive sputtering

K. L. Saenger, C. Cabral, Jr., C. Lavoie, S. M. Rossnagel
Journal: Journal of Applied Physics
J. Appl. Phys. 86, 6084–6087 (1999)
https://doi.org/10.1063/1.371718
Published: December 1999
View article titled, Thermal stability and oxygen-loss characteristics of Pt(O) films prepared by reactive sputtering
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Journal Articles

Interaction between gas rarefaction and metal ionization in ionized physical vapor deposition

S. M. Rossnagel
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 16, 3008–3012 (1998)
https://doi.org/10.1116/1.590333
Published: November 1998
View article titled, Interaction between gas rarefaction and metal ionization in ionized physical vapor deposition
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Journal Articles

Fabrication of Cu interconnects of 50 nm linewidth by electron-beam lithography and high-density plasma etching

Y. Hsu, T. E. F. M. Standaert, G. S. Oehrlein, T. S. Kuan, E. Sayre, K. Rose, K. Y. Lee, S. M. Rossnagel
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 16, 3344–3348 (1998)
https://doi.org/10.1116/1.590379
Published: November 1998
View article titled, Fabrication of Cu interconnects of 50 nm linewidth by electron-beam lithography and high-density plasma etching
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Journal Articles

Directional and ionized physical vapor deposition for microelectronics applications

S. M. Rossnagel
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 16, 2585–2608 (1998)
https://doi.org/10.1116/1.590242
Published: September 1998
View article titled, Directional and ionized physical vapor deposition for microelectronics applications
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Journal Articles

Across-wafer nonuniformity of long throw sputter deposition

A. A. Mayo, S. Hamaguchi, J. H. Joo, S. M. Rossnagel
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 15, 1788–1793 (1997)
https://doi.org/10.1116/1.589526
Published: September 1997
View article titled, Across-wafer nonuniformity of long throw sputter deposition
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Journal Articles

Ionized physical vapor deposition of Cu for high aspect ratio damascene trench fill applications

C. A. Nichols, S. M. Rossnagel, S. Hamaguchi
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 14, 3270–3275 (1996)
https://doi.org/10.1116/1.588819
Published: September 1996
View article titled, Ionized physical vapor deposition of Cu for high aspect ratio damascene trench fill applications
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