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Journal Articles

Thermomechanical characterization and modeling for TSV structures

Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Jay Im, Paul S. Ho, Rui Huang
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 148–157 (2014)
https://doi.org/10.1063/1.4881348
Published: June 2014
View article titled, Thermomechanical characterization and modeling for TSV structures
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Journal Articles

Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration

Tengfei Jiang, Suk-Kyu Ryu, Jay Im, Rui Huang, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 55–66 (2014)
https://doi.org/10.1063/1.4881340
Published: June 2014
View article titled, Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration
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Journal Articles

Preface: Stress-Induced Phenomena and Reliability in 3D Microelectronics

Paul S. Ho, Chao-Kun Hu, Mark Nakamoto, Shinichi Ogawa, Larry Smith, Valeriy Sukharev, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 1–2 (2014)
https://doi.org/10.1063/1.4881337
Published: June 2014
View article titled, Preface: Stress-Induced Phenomena and Reliability in 3D Microelectronics
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Journal Articles

Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects

Tengfei Jiang, Chenglin Wu, Laura Spinella, Jay Im, Nobumichi Tamura, Martin Kunz, Ho-Young Son, Byoung Gyu Kim, Rui Huang, Paul S. Ho
Journal: Applied Physics Letters
Appl. Phys. Lett. 103, 211906 (2013)
https://doi.org/10.1063/1.4833020
Published: November 2013
View article titled, Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects
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Journal Articles

Mode II electromigration failure mechanism in Sn-based Pb-free solder joints with Ni under-bump metallization

Yiwei Wang, Paul S. Ho
Journal: Applied Physics Letters
Appl. Phys. Lett. 103, 121909 (2013)
https://doi.org/10.1063/1.4821819
Published: September 2013
View article titled, Mode II electromigration failure mechanism in Sn-based Pb-free solder joints with Ni under-bump metallization
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Includes: Supplementary data
Journal Articles

Oxygen-induced bi-modal failure phenomenon in SiOx-based resistive switching memory

Yao-Feng Chang, Li Ji, Zhuo-Jie Wu, Fei Zhou, Yanzhen Wang, Fei Xue, Burt Fowler, Edward T. Yu, Paul S. Ho, Jack C. Lee
Journal: Applied Physics Letters
Appl. Phys. Lett. 103, 033521 (2013)
https://doi.org/10.1063/1.4816162
Published: July 2013
View article titled, Oxygen-induced bi-modal failure phenomenon in SiO<sub>x</sub>-based resistive switching memory
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Journal Articles

Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects

Linjun Cao, K. J. Ganesh, Lijuan Zhang, Oliver Aubel, Christian Hennesthal, Meike Hauschildt, Paulo J. Ferreira, Paul S. Ho
Journal: Applied Physics Letters
Appl. Phys. Lett. 102, 131907 (2013)
https://doi.org/10.1063/1.4799484
Published: April 2013
View article titled, Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects
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Journal Articles

Plasma processing of low-k dielectrics

Mikhail R. Baklanov, Jean-Francois de Marneffe, Denis Shamiryan, Adam M. Urbanowicz, Hualiang Shi, Tatyana V. Rakhimova, Huai Huang, Paul S. Ho
Journal: Journal of Applied Physics
J. Appl. Phys. 113, 041101 (2013)
https://doi.org/10.1063/1.4765297
Published: January 2013
View article titled, Plasma processing of low-k dielectrics
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Journal Articles

Size effect on the electron wind force for electromigration at the top metal-dielectric interface in nanoscale interconnects

Zhuo-Jie Wu, Paul S. Ho
Journal: Applied Physics Letters
Appl. Phys. Lett. 101, 101601 (2012)
https://doi.org/10.1063/1.4750067
Published: September 2012
View article titled, Size effect on the electron wind force for electromigration at the top metal-dielectric interface in nanoscale interconnects
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Journal Articles

Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects

Suk-Kyu Ryu, Qiu Zhao, Michael Hecker, Ho-Young Son, Kwang-Yoo Byun, Jay Im, Paul S. Ho, Rui Huang
Journal: Journal of Applied Physics
J. Appl. Phys. 111, 063513 (2012)
https://doi.org/10.1063/1.3696980
Published: March 2012
View article titled, Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects
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Journal Articles

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Suk-Kyu Ryu, Tengfei Jiang, Kuan H. Lu, Jay Im, Ho-Young Son, Kwang-Yoo Byun, Rui Huang, Paul S. Ho
Journal: Applied Physics Letters
Appl. Phys. Lett. 100, 041901 (2012)
https://doi.org/10.1063/1.3678020
Published: January 2012
View article titled, Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique
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Journal Articles

Role of ions, photons, and radicals in inducing plasma damage to ultra low-k dielectrics

Hualiang Shi, Huai Huang, Junjing Bao, Junjun Liu, Paul S. Ho, Yifeng Zhou, Jeremy T. Pender, Michael D. Armacost, David Kyser
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 30, 011206 (2012)
https://doi.org/10.1116/1.3671008
Published: December 2011
View article titled, Role of ions, photons, and radicals in inducing plasma damage to ultra low-<em>k</em> dielectrics
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Journal Articles

Stress‐Induced Delamination Of Through Silicon Via Structures

Suk‐Kyu Ryu, Kuan‐Hsun Lu, Jay Im, Rui Huang, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1378, 153–167 (2011)
https://doi.org/10.1063/1.3615702
Published: September 2011
View article titled, Stress‐Induced Delamination Of Through Silicon Via Structures
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Journal Articles

Thermomechanical Reliability Challenges For 3D Interconnects With Through‐Silicon Vias

Suk‐Kyu Ryu, Kuan‐Hsun Lu, Xuefeng Zhang, Jay Im, Paul S. Ho, Rui Huang
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 189–200 (2010)
https://doi.org/10.1063/1.3527126
Published: November 2010
View article titled, Thermomechanical Reliability Challenges For 3D Interconnects With Through‐Silicon Vias
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Journal Articles

Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation

Lijuan Zhang, Matthias Kraatz, Oliver Aubel, Christian Hennesthal, Ehrenfried Zschech, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 3–11 (2010)
https://doi.org/10.1063/1.3527136
Published: November 2010
View article titled, Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation
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Journal Articles

Nanoindentation of Si Nanostructures: Buckling and Friction at Nanoscales

Huai Huang, Bin Li, Qiu Zhao, Zhiquan Luo, Jay Im, Min K. Kang, Richard A. Allen, Michael W. Cresswell, Rui Huang, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 204–212 (2009)
https://doi.org/10.1063/1.3169260
Published: June 2009
View article titled, Nanoindentation of Si Nanostructures: Buckling and Friction at Nanoscales
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Journal Articles

Line Scaling Effect on Grain Structure for Cu Interconnects

Lijuan Zhang, Jay Im, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 151–155 (2009)
https://doi.org/10.1063/1.3169254
Published: June 2009
View article titled, Line Scaling Effect on Grain Structure for Cu Interconnects
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Journal Articles

Thermal Stresses Analysis of 3‐D Interconnect

Kuan H. Lu, Xuefeng Zhang, Suk‐Kyu Ryu, Rui Huang, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 224–230 (2009)
https://doi.org/10.1063/1.3169263
Published: June 2009
View article titled, Thermal Stresses Analysis of 3‐D Interconnect
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Journal Articles

Chip‐Package Interaction and Crackstop Study for Cu/Ultra low‐k Interconnects

Xuefeng Zhang, Ryan S. Smith, Rui Huang, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 197–203 (2009)
https://doi.org/10.1063/1.3169259
Published: June 2009
View article titled, Chip‐Package Interaction and Crackstop Study for Cu/Ultra low‐k Interconnects
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Journal Articles

Thermomechanical Property Characterization of Ultra Low‐k Materials

Jie‐Hua Zhao, Vikas Gupta, Clay D. Mortensen, Kuan‐Hsun Lu, Darvin R. Edwards, David C. Johnson, Paul S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 87–96 (2009)
https://doi.org/10.1063/1.3169270
Published: June 2009
View article titled, Thermomechanical Property Characterization of Ultra Low‐k Materials
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