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    Journal Articles

    Stress management for 3D through-silicon-via stacking technologies - The next frontier -

    Available to Purchase
    Riko Radojcic, Matt Nowak, Mark Nakamoto
    Journal: AIP Conference Proceedings
    AIP Conf. Proc. 1601, 3–17 (2014)
    https://doi.org/10.1063/1.4881338
    Published: June 2014
    Abstract
    View articletitled, Stress management for 3D through-silicon-via stacking technologies - The next frontier -
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    Journal Articles

    TechTuning: Stress Management For 3D Through‐Silicon‐Via Stacking Technologies

    Available to Purchase
    Riko Radojcic, Matt Nowak, Mark Nakamoto
    Journal: AIP Conference Proceedings
    AIP Conf. Proc. 1378, 5–20 (2011)
    https://doi.org/10.1063/1.3615693
    Published: September 2011
    Abstract
    View articletitled, TechTuning: Stress Management For 3D Through‐Silicon‐Via Stacking Technologies
    Open the PDF for TechTuning: Stress Management For 3D Through‐Silicon‐Via Stacking Technologies in another window

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