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Martin Gall
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Journal Articles

Lateral damage in graphene carved by high energy focused gallium ion beams

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Zhongquan Liao, Tao Zhang, Martin Gall, Arezoo Dianat, Rüdiger Rosenkranz, Rainer Jordan, Gianaurelio Cuniberti, Ehrenfried Zschech
Journal: Applied Physics Letters
Appl. Phys. Lett. 107, 013108 (2015)
https://doi.org/10.1063/1.4926647
Published: July 2015
View articletitled, Lateral damage in graphene carved by high energy focused gallium ion beams
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Includes: Supplementary data
Journal Articles

Advanced concepts for TDDB reliability in conjunction with 3D stress

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Martin Gall, Kong Boon Yeap, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 79–88 (2014)
https://doi.org/10.1063/1.4881342
Published: June 2014
View articletitled, Advanced concepts for TDDB reliability in conjunction with 3D stress
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Journal Articles

In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms

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Kong Boon Yeap, Martin Gall, Zhongquan Liao, Christoph Sander, Uwe Muehle, Patrick Justison, Oliver Aubel, Meike Hauschildt, Armand Beyer, Norman Vogel, Ehrenfried Zschech
Journal: Journal of Applied Physics
J. Appl. Phys. 115, 124101 (2014)
https://doi.org/10.1063/1.4869403
Published: March 2014
View articletitled, In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
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Journal Articles

Large-scale statistical analysis of early failures in Cu electromigration, Part I: Dominating mechanisms

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Meike Hauschildt, Martin Gall, Richard Hernandez
Journal: Journal of Applied Physics
J. Appl. Phys. 108, 013523 (2010)
https://doi.org/10.1063/1.3374701
Published: July 2010
View articletitled, Large-scale statistical analysis of early failures in Cu electromigration, Part I: Dominating mechanisms
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Journal Articles

Large-scale statistical analysis of early failures in Cu electromigration, Part II: Scaling behavior and short-length effects

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Martin Gall, Meike Hauschildt, Richard Hernandez
Journal: Journal of Applied Physics
J. Appl. Phys. 108, 013524 (2010)
https://doi.org/10.1063/1.3374702
Published: July 2010
View articletitled, Large-scale statistical analysis of early failures in Cu electromigration, Part II: Scaling behavior and short-length effects
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Journal Articles

Examination of Critical Length Effect in Copper Interconnects With Oxide and Low‐k Dielectrics

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Stacye Thrasher, Martin Gall, Cristiano Capasso, Patrick Justison, Richard Hernandez, Timothy Nguyen, Hisao Kawasaki
Journal: AIP Conference Proceedings
AIP Conf. Proc. 741, 165–172 (2004)
https://doi.org/10.1063/1.1845846
Published: December 2004
View articletitled, Examination of Critical Length Effect in Copper Interconnects With Oxide and Low‐k Dielectrics
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