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M. Hauschildt
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Journal Articles

Electromigration void nucleation and growth analysis using large-scale early failure statistics

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M. Hauschildt, M. Gall, C. Hennesthal, G. Talut, O. Aubel, K. B. Yeap, E. Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 89–98 (2014)
https://doi.org/10.1063/1.4881343
Published: June 2014
View articletitled, Electromigration void nucleation and growth analysis using large-scale early failure statistics
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Journal Articles

Large‐Scale Statistics for Cu Electromigration

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M. Hauschildt, M. Gall, R. Hernandez
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 31–46 (2009)
https://doi.org/10.1063/1.3169264
Published: June 2009
View articletitled, Large‐Scale Statistics for Cu Electromigration
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Journal Articles

The influence of process parameters on electromigration lifetime statistics

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M. Hauschildt, M. Gall, P. Justison, R. Hernandez, P. S. Ho
Journal: Journal of Applied Physics
J. Appl. Phys. 104, 043503 (2008)
https://doi.org/10.1063/1.2956827
Published: August 2008
View articletitled, The influence of process parameters on electromigration lifetime statistics
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Journal Articles

Large‐Scale Statistical Study of Electromigration Early Failure for Cu/low‐k Interconnects

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M. Hauschildt, M. Gall, P. Justison, R. Hernandez, M. Herrick
Journal: AIP Conference Proceedings
AIP Conf. Proc. 945, 66–81 (2007)
https://doi.org/10.1063/1.2815785
Published: October 2007
View articletitled, Large‐Scale Statistical Study of Electromigration Early Failure for Cu/low‐k Interconnects
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Journal Articles

Statistical analysis of electromigration lifetimes and void evolution

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M. Hauschildt, M. Gall, S. Thrasher, P. Justison, R. Hernandez, H. Kawasaki, P. S. Ho
Journal: Journal of Applied Physics
J. Appl. Phys. 101, 043523 (2007)
https://doi.org/10.1063/1.2655531
Published: February 2007
View articletitled, Statistical analysis of electromigration lifetimes and void evolution
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Journal Articles

Analysis of electromigration statistics for Cu interconnects

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M. Hauschildt, M. Gall, S. Thrasher, P. Justison, L. Michaelson, R. Hernandez, H. Kawasaki, P. S. Ho
Journal: Applied Physics Letters
Appl. Phys. Lett. 88, 211907 (2006)
https://doi.org/10.1063/1.2201872
Published: May 2006
View articletitled, Analysis of electromigration statistics for Cu interconnects
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Journal Articles

Statistical Analysis of Electromigration Lifetimes for Cu Interconnects

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M. Hauschildt, M. Gall, S. Thrasher, P. Justison, L. Michaelson, R. Hernandez, H. Kawasaki, P. S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 817, 164–174 (2006)
https://doi.org/10.1063/1.2173546
Published: February 2006
View articletitled, Statistical Analysis of Electromigration Lifetimes for Cu Interconnects
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Journal Articles

Statistical Analysis of Electromigration in Cu Interconnects With Multi‐link Test Structures

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P. Justison, M. Gall, S. Thrasher, M. Hauschildt, R. Hernandez, C. Capasso, H. Kawasaki, P. S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 741, 148–155 (2004)
https://doi.org/10.1063/1.1845844
Published: December 2004
View articletitled, Statistical Analysis of Electromigration in Cu Interconnects With Multi‐link Test Structures
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Journal Articles

Statistical Analysis of Electromigration Lifetimes and Void Evolution

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M. Hauschildt, M. Gall, S. Thrasher, P. Justison, L. Michaelson, R. Hernandez, H. Kawasaki, P. S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 741, 112–123 (2004)
https://doi.org/10.1063/1.1845841
Published: December 2004
View articletitled, Statistical Analysis of Electromigration Lifetimes and Void Evolution
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