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Journal Articles

A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits

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K. Kutukova, S. Niese, C. Sander, Y. Standke, J. Gluch, M. Gall, E. Zschech
Journal: Applied Physics Letters
Appl. Phys. Lett. 113, 091901 (2018)
https://doi.org/10.1063/1.5031204
Published: August 2018
View articletitled, A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits
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Journal Articles

Electromigration void nucleation and growth analysis using large-scale early failure statistics

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M. Hauschildt, M. Gall, C. Hennesthal, G. Talut, O. Aubel, K. B. Yeap, E. Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 89–98 (2014)
https://doi.org/10.1063/1.4881343
Published: June 2014
View articletitled, Electromigration void nucleation and growth analysis using large-scale early failure statistics
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Journal Articles

Large‐Scale Statistics for Cu Electromigration

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M. Hauschildt, M. Gall, R. Hernandez
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 31–46 (2009)
https://doi.org/10.1063/1.3169264
Published: June 2009
View articletitled, Large‐Scale Statistics for Cu Electromigration
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Journal Articles

The influence of process parameters on electromigration lifetime statistics

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M. Hauschildt, M. Gall, P. Justison, R. Hernandez, P. S. Ho
Journal: Journal of Applied Physics
J. Appl. Phys. 104, 043503 (2008)
https://doi.org/10.1063/1.2956827
Published: August 2008
View articletitled, The influence of process parameters on electromigration lifetime statistics
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Journal Articles

Large‐Scale Statistical Study of Electromigration Early Failure for Cu/low‐k Interconnects

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M. Hauschildt, M. Gall, P. Justison, R. Hernandez, M. Herrick
Journal: AIP Conference Proceedings
AIP Conf. Proc. 945, 66–81 (2007)
https://doi.org/10.1063/1.2815785
Published: October 2007
View articletitled, Large‐Scale Statistical Study of Electromigration Early Failure for Cu/low‐k Interconnects
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Journal Articles

Statistical analysis of electromigration lifetimes and void evolution

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M. Hauschildt, M. Gall, S. Thrasher, P. Justison, R. Hernandez, H. Kawasaki, P. S. Ho
Journal: Journal of Applied Physics
J. Appl. Phys. 101, 043523 (2007)
https://doi.org/10.1063/1.2655531
Published: February 2007
View articletitled, Statistical analysis of electromigration lifetimes and void evolution
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Journal Articles

Analysis of electromigration statistics for Cu interconnects

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M. Hauschildt, M. Gall, S. Thrasher, P. Justison, L. Michaelson, R. Hernandez, H. Kawasaki, P. S. Ho
Journal: Applied Physics Letters
Appl. Phys. Lett. 88, 211907 (2006)
https://doi.org/10.1063/1.2201872
Published: May 2006
View articletitled, Analysis of electromigration statistics for Cu interconnects
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Journal Articles

Statistical Analysis of Electromigration Lifetimes for Cu Interconnects

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M. Hauschildt, M. Gall, S. Thrasher, P. Justison, L. Michaelson, R. Hernandez, H. Kawasaki, P. S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 817, 164–174 (2006)
https://doi.org/10.1063/1.2173546
Published: February 2006
View articletitled, Statistical Analysis of Electromigration Lifetimes for Cu Interconnects
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Journal Articles

Statistical Analysis of Electromigration in Cu Interconnects With Multi‐link Test Structures

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P. Justison, M. Gall, S. Thrasher, M. Hauschildt, R. Hernandez, C. Capasso, H. Kawasaki, P. S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 741, 148–155 (2004)
https://doi.org/10.1063/1.1845844
Published: December 2004
View articletitled, Statistical Analysis of Electromigration in Cu Interconnects With Multi‐link Test Structures
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Journal Articles

Prediction of Maximum Allowed RMS Currents for Electromigration Design Guidelines

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K. Ramakrishna, M. Gall, P. Justison, H. Kawasaki
Journal: AIP Conference Proceedings
AIP Conf. Proc. 741, 156–164 (2004)
https://doi.org/10.1063/1.1845845
Published: December 2004
View articletitled, Prediction of Maximum Allowed RMS Currents for Electromigration Design Guidelines
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Journal Articles

Chip‐Level Electromigration Reliability for Cu Interconnects

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M. Gall, C. Oh, H. Haznedar, A. Grinshpon, V. Zolotov, P. Ku, R. Panda, E. Demircan, J. Müller, P. Justison, K. Ramakrishna, S. Thrasher, R. Hernandez, M. Herrick, R. Fox, B. Boeck, H. Kawasaki
Journal: AIP Conference Proceedings
AIP Conf. Proc. 741, 73–84 (2004)
https://doi.org/10.1063/1.1845838
Published: December 2004
View articletitled, Chip‐Level Electromigration Reliability for Cu Interconnects
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Journal Articles

Statistical Analysis of Electromigration Lifetimes and Void Evolution

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M. Hauschildt, M. Gall, S. Thrasher, P. Justison, L. Michaelson, R. Hernandez, H. Kawasaki, P. S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 741, 112–123 (2004)
https://doi.org/10.1063/1.1845841
Published: December 2004
View articletitled, Statistical Analysis of Electromigration Lifetimes and Void Evolution
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Journal Articles

Electromigration in multilevel interconnects with polymeric low-k interlevel dielectrics

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P. Justison, E. Ogawa, P. S. Ho, M. Gall, C. Capasso, D. Jawarani, J. Wetzel, H. Kawasaki
Journal: Applied Physics Letters
Appl. Phys. Lett. 79, 4414–4416 (2001)
https://doi.org/10.1063/1.1421426
Published: December 2001
View articletitled, Electromigration in multilevel interconnects with polymeric low-k interlevel dielectrics
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Journal Articles

Statistical analysis of early failures in electromigration

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M. Gall, C. Capasso, D. Jawarani, R. Hernandez, H. Kawasaki, P. S. Ho
Journal: Journal of Applied Physics
J. Appl. Phys. 90, 732–740 (2001)
https://doi.org/10.1063/1.1377304
Published: July 2001
View articletitled, Statistical analysis of early failures in electromigration
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Journal Articles

Detection and analysis of early failures in electromigration

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M. Gall, C. Capasso, D. Jawarani, R. Hernandez, H. Kawasaki, P. S. Ho
Journal: Applied Physics Letters
Appl. Phys. Lett. 76, 843–845 (2000)
https://doi.org/10.1063/1.125603
Published: February 2000
View articletitled, Detection and analysis of early failures in electromigration
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Journal Articles

Thermal stresses in Cu damascene submicron line structures

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J. Kasthurirangan, Y. Du, P. Ho, C. Capasso, M. Gall, D. Jawarani, R. Hernandez, H. Kawasaki
Journal: AIP Conference Proceedings
AIP Conf. Proc. 491, 304–316 (1999)
https://doi.org/10.1063/1.59921
Published: November 1999
View articletitled, Thermal stresses in Cu damascene submicron line structures
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Journal Articles

Electromigration early failure distribution in submicron interconnects

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M. Gall, P. S. Ho, C. Capasso, D. Jawarani, R. Hernandez, H. Kawasaki
Journal: AIP Conference Proceedings
AIP Conf. Proc. 491, 3–14 (1999)
https://doi.org/10.1063/1.59923
Published: November 1999
View articletitled, Electromigration early failure distribution in submicron interconnects
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Journal Articles

Void-free chemically vapor-deposited aluminum dual inlaid metallization schemes for ultra-large-scale-integrated via and interconnect applications

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T. P. Ong, R. Fiordalice, R. Venkatraman, S. Garcia, A. Jain, T. Sparks, J. Farkas, M. Fernandes, M. Gall, D. Jawarani, J. Klein, E. Weitzman, H. Kawasaki, Wei Wu, R. Blumenthal, F. Pintchovski, R. Marsh, P. Zhang, H. Zhang, T. Guo, R. Mosely
Journal: Applied Physics Letters
Appl. Phys. Lett. 73, 82–84 (1998)
https://doi.org/10.1063/1.121731
Published: July 1998
View articletitled, Void-free chemically vapor-deposited aluminum dual inlaid metallization schemes for ultra-large-scale-integrated via and interconnect applications
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Journal Articles

Comparison of via electromigration for Cu, CVD-Al, and CVD-W

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H. Kawasaki, M. Gall, D. Jawarani, R. Hernandez, C. Capasso
Journal: AIP Conference Proceedings
AIP Conf. Proc. 418, 25–38 (1998)
https://doi.org/10.1063/1.54646
Published: January 1998
View articletitled, Comparison of via electromigration for Cu, CVD-Al, and CVD-W
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Journal Articles

Statistical evaluation of device-level electromigration reliability

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M. Gall, C. Capasso, D. Jawarani, R. Hernandez, H. Kawasaki, P. S. Ho
Journal: AIP Conference Proceedings
AIP Conf. Proc. 418, 483–494 (1998)
https://doi.org/10.1063/1.54671
Published: January 1998
View articletitled, Statistical evaluation of device-level electromigration reliability
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