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Journal Articles

Charge transport model to predict intrinsic reliability for dielectric materials

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Sean P. Ogden, Juan Borja, Joel L. Plawsky, T.-M. Lu, Kong Boon Yeap, William N. Gill
Journal: Journal of Applied Physics
J. Appl. Phys. 118, 124102 (2015)
https://doi.org/10.1063/1.4931425
Published: September 2015
View articletitled, Charge transport model to predict intrinsic reliability for dielectric materials
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Journal Articles

Advanced concepts for TDDB reliability in conjunction with 3D stress

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Martin Gall, Kong Boon Yeap, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 79–88 (2014)
https://doi.org/10.1063/1.4881342
Published: June 2014
View articletitled, Advanced concepts for TDDB reliability in conjunction with 3D stress
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Journal Articles

In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms

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Kong Boon Yeap, Martin Gall, Zhongquan Liao, Christoph Sander, Uwe Muehle, Patrick Justison, Oliver Aubel, Meike Hauschildt, Armand Beyer, Norman Vogel, Ehrenfried Zschech
Journal: Journal of Applied Physics
J. Appl. Phys. 115, 124101 (2014)
https://doi.org/10.1063/1.4869403
Published: March 2014
View articletitled, In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
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Journal Articles

Nanomechanical Characterization and Metrology for Low‐k and ULK Materials

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Ude D. Hangen, Kong‐Boon Yeap, David Vodnick, Ehrenfried Zschech, Han Li, Joost Vlassak
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1395, 240–248 (2011)
https://doi.org/10.1063/1.3657898
Published: November 2011
View articletitled, Nanomechanical Characterization and Metrology for Low‐k and ULK Materials
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Journal Articles

Nanoindentation Study Of Elastic Anisotropy Of Cu Single Crystals And Grains In TSVs

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Kong Boon Yeap, Ude D. Hangen, Dierk Raabe, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1378, 121–128 (2011)
https://doi.org/10.1063/1.3615699
Published: September 2011
View articletitled, Nanoindentation Study Of Elastic Anisotropy Of Cu Single Crystals And Grains In TSVs
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Journal Articles

Cohesive Toughness Of Low‐k Film With Periodically Changing Elastic Modulus: Cube‐Corner Indentation

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Kong Boon Yeap, Ude Hangen, Yvonne Ritz, Taek‐Soo Kim, Reinhold Dauskardt, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 159–165 (2010)
https://doi.org/10.1063/1.3527123
Published: November 2010
View articletitled, Cohesive Toughness Of Low‐k Film With Periodically Changing Elastic Modulus: Cube‐Corner Indentation
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Journal Articles

Determining interfacial properties of submicron low- k films on Si substrate by using wedge indentation technique

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Kong Boon Yeap, Kaiyang Zeng, Haiyan Jiang, Lu Shen, Dongzhi Chi
Journal: Journal of Applied Physics
J. Appl. Phys. 101, 123531 (2007)
https://doi.org/10.1063/1.2749473
Published: June 2007
View articletitled, Determining interfacial properties of submicron low- k films on Si substrate by using wedge indentation technique
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