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Journal Articles

Electromigration in three-dimensional integrated circuits

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Zesheng Shen, Siyi Jing, Yiyuan Heng, Yifan Yao, K. N. Tu, Yingxia Liu
Journal: Applied Physics Reviews
Appl. Phys. Rev. 10, 021309 (2023)
https://doi.org/10.1063/5.0139658
Published: May 2023
View articletitled, Electromigration in three-dimensional integrated circuits
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Journal Articles

A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production

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K. N. Tu, A. M. Gusak
Journal: Journal of Applied Physics
J. Appl. Phys. 126, 075109 (2019)
https://doi.org/10.1063/1.5111159
Published: August 2019
View articletitled, A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production
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Journal Articles

Effect of Joule heating and current crowding on electromigration in mobile technology

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K. N. Tu, Yingxia Liu, Menglu Li
Journal: Applied Physics Reviews
Appl. Phys. Rev. 4, 011101 (2017)
https://doi.org/10.1063/1.4974168
Published: January 2017
View articletitled, Effect of Joule heating and current crowding on electromigration in mobile technology
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Journal Articles

Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology

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Menglu Li, Dong Wook Kim, Sam Gu, Dilworth Y. Parkinson, Harold Barnard, K. N. Tu
Journal: Journal of Applied Physics
J. Appl. Phys. 120, 075105 (2016)
https://doi.org/10.1063/1.4961219
Published: August 2016
View articletitled, Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology
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Journal Articles

Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits

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Yingxia Liu, Menglu Li, Dong Wook Kim, Sam Gu, K. N. Tu
Journal: Journal of Applied Physics
J. Appl. Phys. 118, 135304 (2015)
https://doi.org/10.1063/1.4932598
Published: October 2015
View articletitled, Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits
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Journal Articles

Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography

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Tian Tian, Feng Xu, Jung Kyu Han, Daechul Choi, Yin Cheng, Lukas Helfen, Marco Di Michiel, Tilo Baumbach, K. N. Tu
Journal: Applied Physics Letters
Appl. Phys. Lett. 99, 082114 (2011)
https://doi.org/10.1063/1.3628342
Published: August 2011
View articletitled, Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography
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Journal Articles

Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni

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J. O. Suh, K. N. Tu, Albert T. Wu, N. Tamura
Journal: Journal of Applied Physics
J. Appl. Phys. 109, 123513 (2011)
https://doi.org/10.1063/1.3592184
Published: June 2011
View articletitled, Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni
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Journal Articles

Improved Interconnect Properties For Nano‐Twinned Copper: Microstructure And Stability

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Di Xu, Hsin‐Ping Chen, K. N. Tu
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 23–32 (2010)
https://doi.org/10.1063/1.3527132
Published: November 2010
View articletitled, Improved Interconnect Properties For Nano‐Twinned Copper: Microstructure And Stability
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Journal Articles

Erratum: “In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper” [J. Appl. Phys. 105, 023521 (2009)]

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Di Xu, Vinay Sriram, Vidvuds Ozolins, Jenn-Ming Yang, K. N. Tu, Gery R. Stafford, Carlos Beauchamp
Journal: Journal of Applied Physics
J. Appl. Phys. 108, 099901 (2010)
https://doi.org/10.1063/1.3503174
Published: November 2010
View articletitled, Erratum: “In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper” [J. Appl. Phys. 105, 023521 (2009)]
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Journal Articles

Stability of nanoscale twins in copper under electric current stressing

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Kuan-Chia Chen, Wen-Wei Wu, Chien-Neng Liao, Lih-Juann Chen, K. N. Tu
Journal: Journal of Applied Physics
J. Appl. Phys. 108, 066103 (2010)
https://doi.org/10.1063/1.3483949
Published: September 2010
View articletitled, Stability of nanoscale twins in copper under electric current stressing
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Journal Articles

Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

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S. W. Liang, Chih Chen, J. K. Han, Luhua Xu, K. N. Tu, Yi-Shao Lai
Journal: Journal of Applied Physics
J. Appl. Phys. 107, 093715 (2010)
https://doi.org/10.1063/1.3410796
Published: May 2010
View articletitled, Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
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Journal Articles

High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction

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Kai Chen, N. Tamura, Wei Tang, M. Kunz, Yi-Chia Chou, K. N. Tu, Yi-Shao Lai
Journal: Journal of Applied Physics
J. Appl. Phys. 107, 063502 (2010)
https://doi.org/10.1063/1.3309750
Published: March 2010
View articletitled, High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction
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Journal Articles

In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction

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Kai Chen, N. Tamura, M. Kunz, K. N. Tu, Yi-Shao Lai
Journal: Journal of Applied Physics
J. Appl. Phys. 106, 023502 (2009)
https://doi.org/10.1063/1.3157196
Published: July 2009
View articletitled, In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction
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Journal Articles

In‐situ TEM Study of Electromigration in Cu lines

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C. N. Liao, K. C. Chen, W. W. Wu, L. J. Chen, K. N. Tu
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 12–19 (2009)
https://doi.org/10.1063/1.3169252
Published: June 2009
View articletitled, In‐situ TEM Study of Electromigration in Cu lines
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Journal Articles

In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper

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Di Xu, Vinay Sriram, Vidvuds Ozolins, Jenn-Ming Yang, K. N. Tu, Gery R. Stafford, Carlos Beauchamp
Journal: Journal of Applied Physics
J. Appl. Phys. 105, 023521 (2009)
https://doi.org/10.1063/1.3068191
Published: January 2009
View articletitled, In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper
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Journal Articles

Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper

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Luhua Xu, Di Xu, K. N. Tu, Yuan Cai, Ning Wang, Pradeep Dixit, John H. L. Pang, Jianmin Miao
Journal: Journal of Applied Physics
J. Appl. Phys. 104, 113717 (2008)
https://doi.org/10.1063/1.3035944
Published: December 2008
View articletitled, Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper
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Journal Articles

The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing

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D. Yang, Y. C. Chan, K. N. Tu
Journal: Applied Physics Letters
Appl. Phys. Lett. 93, 041907 (2008)
https://doi.org/10.1063/1.2963473
Published: July 2008
View articletitled, The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing
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Journal Articles

Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction

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Kai Chen, N. Tamura, B. C. Valek, K. N. Tu
Journal: Journal of Applied Physics
J. Appl. Phys. 104, 013513 (2008)
https://doi.org/10.1063/1.2952073
Published: July 2008
View articletitled, Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction
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Journal Articles

Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

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Luhua Xu, Jung-Kyu Han, Jarrett Jun Liang, K. N. Tu, Yi-Shao Lai
Journal: Applied Physics Letters
Appl. Phys. Lett. 92, 262104 (2008)
https://doi.org/10.1063/1.2953692
Published: July 2008
View articletitled, Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column
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Journal Articles

Solder joints fabricated by explosively reacting nanolayers

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M. S. Tong, D. Sturgess, K. N. Tu, J. M. Yang
Journal: Applied Physics Letters
Appl. Phys. Lett. 92, 144101 (2008)
https://doi.org/10.1063/1.2907850
Published: April 2008
View articletitled, Solder joints fabricated by explosively reacting nanolayers
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