1-2 of 2
K. B. Yeap
Close
Save search
Follow your search
Access your saved searches in your account
Close Modal
Sort by
Journal Articles

Electromigration void nucleation and growth analysis using large-scale early failure statistics

Available to Purchase
M. Hauschildt, M. Gall, C. Hennesthal, G. Talut, O. Aubel, K. B. Yeap, E. Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 89–98 (2014)
https://doi.org/10.1063/1.4881343
Published: June 2014
View articletitled, Electromigration void nucleation and growth analysis using large-scale early failure statistics
Open the PDF for Electromigration void nucleation and growth analysis using large-scale early failure statistics in another window
Journal Articles

Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias

Available to Purchase
L. W. Kong, J. R. Lloyd, K. B Yeap, E. Zschech, A. Rudack, M. Liehr, A. Diebold
Journal: Journal of Applied Physics
J. Appl. Phys. 110, 053502 (2011)
https://doi.org/10.1063/1.3629988
Published: September 2011
View articletitled, Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias
Open the PDF for Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias in another window