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Journal Articles

Microstructure, impurity and metal cap effects on Cu electromigration

C.-K. Hu, L. G. Gignac, J. Ohm, C. M. Breslin, E. Huang, G. Bonilla, E. Liniger, R. Rosenberg, S. Choi, A. H. Simon

AIP Conf. Proc. 1601, 67–78 (2014)

https://doi.org/10.1063/1.4881341

Published: June 2014

View articletitled, Microstructure, impurity and metal cap effects on Cu electromigration

Journal Articles

Electromigration in Cu(Al) and Cu(Mn) damascene lines

C.-K. Hu, J. Ohm, L. M. Gignac, C. M. Breslin, S. Mittal, G. Bonilla, D. Edelstein, R. Rosenberg, S. Choi, J. J. An, A. H. Simon, M. S. Angyal, L. Clevenger, J. Maniscalco, T. Nogami, C. Penny, B. Y. Kim

J. Appl. Phys. 111, 093722 (2012)

https://doi.org/10.1063/1.4711070

Published: May 2012

View articletitled, Electromigration in Cu(Al) and Cu(Mn) damascene lines