Page 1 | Search Results | AIP Publishing

Skip to Main Content

Skip Nav Destination

1-3 of 3

Sort by

Sort Order Select

Journal Articles

Assessment of fracture and elastoplastic properties of thin and very thin films

M. Trueba, D. Gonzalez, I. Ocaña, M. R. Elizalde, J. M. Martinez-Esnaola, M. T. Hernandez, M. Haverty, G. Xu, D. Pantuso

AIP Conf. Proc. 1601, 158–167 (2014)

https://doi.org/10.1063/1.4881349

Published: June 2014

View articletitled, Assessment of fracture and elastoplastic properties of thin and very thin films

Journal Articles

Damage Induced In Interconnect Structures Mimicking Stresses During Flip Chip Packaging

I. Castro, I. Ocaña, M. R. Elizalde, J. M. Martínez‐Esnaola, D. Pantuso, G. Leatherman, G. Xu

AIP Conf. Proc. 1300, 238–244 (2010)

https://doi.org/10.1063/1.3527131

Published: November 2010

View articletitled, Damage Induced In Interconnect Structures Mimicking Stresses During Flip Chip Packaging

Journal Articles

Adhesion Studies in Low‐k Interconnects Using Cross Sectional Nanoindentation

J. M. Molina‐Aldareguia, I. Ocaña, D. Gonzalez, M. R. Elizalde, J. M. Sánchez, J. M. Martínez‐Esnaola, J. Gil Sevillano, T. Scherban, D. Pantuso, B. Sun, G. Xu, B. Miner, J. He, J. Maiz

AIP Conf. Proc. 817, 104–109 (2006)

https://doi.org/10.1063/1.2173538

Published: February 2006

View articletitled, Adhesion Studies in Low‐k Interconnects Using Cross Sectional Nanoindentation