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Journal Articles

A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability

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A. S. Saleh, K. Croes, H. Ceric, I. De Wolf, H. Zahedmanesh
Journal: Journal of Applied Physics
J. Appl. Phys. 134, 135102 (2023)
https://doi.org/10.1063/5.0165949
Published: October 2023
View articletitled, A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability
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Includes: Supplementary data
Journal Articles

Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds

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H. Ceric, H. Zahedmanesh, K. Croes, R. Lacerda de Orio, S. Selberherr
Journal: Journal of Applied Physics
J. Appl. Phys. 133, 105101 (2023)
https://doi.org/10.1063/5.0134692
Published: March 2023
View articletitled, Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
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Journal Articles

Void-dynamics in nano-wires and the role of microstructure investigated via a multi-scale physics-based model

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A. S. Saleh, H. Ceric, H. Zahednamesh
Journal: Journal of Applied Physics
J. Appl. Phys. 129, 125102 (2021)
https://doi.org/10.1063/5.0039953
Published: March 2021
View articletitled, Void-dynamics in nano-wires and the role of microstructure investigated via a multi-scale physics-based model
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Includes: Supplementary data
Journal Articles

Modeling of microstructural effects on electromigration failure

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H. Ceric, R. L. de Orio, W. Zisser, S. Selberherr
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 99–113 (2014)
https://doi.org/10.1063/1.4881344
Published: June 2014
View articletitled, Modeling of microstructural effects on electromigration failure
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Journal Articles

Hot-carrier degradation caused interface state profile—Simulation versus experiment

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I. Starkov, S. Tyaginov, H. Enichlmair, J. Cervenka, C. Jungemann, S. Carniello, J. M. Park, H. Ceric, T. Grasser
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 29, 01AB09 (2011)
https://doi.org/10.1116/1.3534021
Published: January 2011
View articletitled, Hot-carrier degradation caused interface state profile—Simulation versus experiment
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Journal Articles

Stress‐Induced Anisotropy of Electromigration in Copper Interconnects

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H. Ceric, R. Lacerda de Orio, J. Cervenka, S. Selberherr
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 56–62 (2009)
https://doi.org/10.1063/1.3169267
Published: June 2009
View articletitled, Stress‐Induced Anisotropy of Electromigration in Copper Interconnects
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Journal Articles

Microstructure and Stress Aspects of Electromigration Modeling

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H. Ceric, R. Heinzl, Ch. Hollauer, T. Grasser, S. Selberherr
Journal: AIP Conference Proceedings
AIP Conf. Proc. 817, 262–268 (2006)
https://doi.org/10.1063/1.2173558
Published: February 2006
View articletitled, Microstructure and Stress Aspects of Electromigration Modeling
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