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1-20 of 22
G. C. Lim
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Proceedings Papers
Proceedings Papers
Process development of laser machining of carbon fibre reinforced plastic composites
Available to PurchaseJournal Articles
Laser-induced Ni(Pt) germanosilicide formation through a self-limiting melting phenomenon on Si 1 − x Ge x ∕ Si heterostructure
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Journal:
Applied Physics Letters
Appl. Phys. Lett. 90, 073108 (2007)
Published: February 2007
Journal Articles
Nickel silicide formation using multiple-pulsed laser annealing
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Journal:
Journal of Applied Physics
J. Appl. Phys. 101, 034307 (2007)
Published: February 2007
Journal Articles
Fabrication of waveguides in Foturan by femtosecond laser
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Journal:
Journal of Laser Applications
J. Laser Appl. 18, 320–324 (2006)
Published: November 2006
Proceedings Papers
Writing waveguide in photosensitive glass using ultrafast laser
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Proceedings Papers
A process study of laser micro-drilling vias for wafer-level chip scale packaging
Available to PurchaseJournal Articles
Laser-induced Ni ( Ti ) silicide formation
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Journal:
Applied Physics Letters
Appl. Phys. Lett. 88, 113108 (2006)
Published: March 2006
Journal Articles
Pulsed laser-induced silicidation on TiN-capped Co ∕ Si bilayers
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Journal:
Journal of Applied Physics
J. Appl. Phys. 99, 044902 (2006)
Published: February 2006
Proceedings Papers
Journal Articles
Micromelting and its effects on surface topography and properties in laser polishing of stainless steel
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Journal:
Journal of Laser Applications
J. Laser Appl. 16, 221–228 (2004)
Published: December 2004
Proceedings Papers
Investigation on femtosecond pulse laser processing of sapphire
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Proceedings Papers
248 nm excimer-laser-induced native oxide film formation on GaN surface
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Proceedings Papers
Proceedings Papers
Ultrashort pulse laser machining of microchannels in polymers and glass materials for fabrication of a microfluidic optical switch
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Process study for laser-induced surface coloration
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Journal:
Journal of Laser Applications
J. Laser Appl. 14, 215–220 (2002)
Published: October 2002
Proceedings Papers
High quality laser microcutting of difficult-to-cut materials - Copper and silicon wafer
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Proceedings Papers
Proceedings Papers
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