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Journal Articles

Microstructure, impurity and metal cap effects on Cu electromigration

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C.-K. Hu, L. G. Gignac, J. Ohm, C. M. Breslin, E. Huang, G. Bonilla, E. Liniger, R. Rosenberg, S. Choi, A. H. Simon
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 67–78 (2014)
https://doi.org/10.1063/1.4881341
Published: June 2014
View articletitled, Microstructure, impurity and metal cap effects on Cu electromigration
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Journal Articles

Electromigration Challenges for Nanoscale Cu Wiring

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C.‐K. Hu, L. M. Gignac, E. Liniger, E. Huang, S. Greco, P. McLaughlin, C.‐C. Yang, J. J. Demarest
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 3–11 (2009)
https://doi.org/10.1063/1.3169265
Published: June 2009
View articletitled, Electromigration Challenges for Nanoscale Cu Wiring
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Journal Articles

Electromigration Reliability of Advanced Interconnects

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C.‐K. Hu, L. M. Gignac, B. Baker‐O'Neal, E. Liniger, R. Yu, P. Flaitz, A. K. Stamper
Journal: AIP Conference Proceedings
AIP Conf. Proc. 945, 27–41 (2007)
https://doi.org/10.1063/1.2815782
Published: October 2007
View articletitled, Electromigration Reliability of Advanced Interconnects
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Journal Articles

Effect of metal liner on electromigration in Cu Damascene lines

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C.-K. Hu, L. M. Gignac, E. Liniger, C. Detavernier, S. G. Malhotra, A. Simon
Journal: Journal of Applied Physics
J. Appl. Phys. 98, 124501 (2005)
https://doi.org/10.1063/1.2140872
Published: December 2005
View articletitled, Effect of metal liner on electromigration in Cu Damascene lines
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Journal Articles

Simple model for time-dependent dielectric breakdown in inter- and intralevel low- k dielectrics

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J. R. Lloyd, E. Liniger, T. M. Shaw
Journal: Journal of Applied Physics
J. Appl. Phys. 98, 084109 (2005)
https://doi.org/10.1063/1.2112171
Published: October 2005
View articletitled, Simple model for time-dependent dielectric breakdown in inter- and intralevel low- k dielectrics
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Journal Articles

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

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C.-K. Hu, L. Gignac, E. Liniger, B. Herbst, D. L. Rath, S. T. Chen, S. Kaldor, A. Simon, W.-T. Tseng
Journal: Applied Physics Letters
Appl. Phys. Lett. 83, 869–871 (2003)
https://doi.org/10.1063/1.1596375
Published: August 2003
View articletitled, Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
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Journal Articles

Reduced electromigration of Cu wires by surface coating

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C.-K. Hu, L. Gignac, R. Rosenberg, E. Liniger, J. Rubino, C. Sambucetti, A. Domenicucci, X. Chen, A. K. Stamper
Journal: Applied Physics Letters
Appl. Phys. Lett. 81, 1782–1784 (2002)
https://doi.org/10.1063/1.1504491
Published: September 2002
View articletitled, Reduced electromigration of Cu wires by surface coating
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Journal Articles

In situ study of void growth kinetics in electroplated Cu lines

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E. Liniger, L. Gignac, C.-K. Hu, S. Kaldor
Journal: Journal of Applied Physics
J. Appl. Phys. 92, 1803–1810 (2002)
https://doi.org/10.1063/1.1492871
Published: August 2002
View articletitled, In situ study of void growth kinetics in electroplated Cu lines
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Journal Articles

The effect of stress on the dielectric properties of barium strontium titanate thin films

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T. M. Shaw, Z. Suo, M. Huang, E. Liniger, R. B. Laibowitz, J. D. Baniecki
Journal: Applied Physics Letters
Appl. Phys. Lett. 75, 2129–2131 (1999)
https://doi.org/10.1063/1.124939
Published: October 1999
View articletitled, The effect of stress on the dielectric properties of barium strontium titanate thin films
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