1-20 of 36
Conal E. Murray
Close
Save search
Follow your search
Access your saved searches in your account
Close Modal
Sort by
Journal Articles

Auxetic crystals under stress: Peering into their mechanics using x-rays

Conal E. Murray
Journal: Journal of Applied Physics
J. Appl. Phys. 125, 045101 (2019)
https://doi.org/10.1063/1.5052192
Published: January 2019
View article titled, Auxetic crystals under stress: Peering into their mechanics using x-rays
Open the PDF for Auxetic crystals under stress: Peering into their mechanics using x-rays in another window
Includes: Supplementary data
Journal Articles

Review Article: Stress in thin films and coatings: Current status, challenges, and prospects

Featured
Grégory Abadias, Eric Chason, Jozef Keckes, Marco Sebastiani, Gregory B. Thompson, Etienne Barthel, Gary L. Doll, Conal E. Murray, Chris H. Stoessel, Ludvik Martinu
Journal: Journal of Vacuum Science & Technology A
J. Vac. Sci. Technol. A 36, 020801 (2018)
https://doi.org/10.1116/1.5011790
Published: March 2018
View article titled, Review Article: Stress in thin films and coatings: Current status, challenges, and prospects
Open the PDF for Review Article: Stress in thin films and coatings: Current status, challenges, and prospects in another window
Journal Articles

Effects of strain energy on the recrystallization within narrow metallization

Conal E. Murray
Journal: Journal of Applied Physics
J. Appl. Phys. 123, 045106 (2018)
https://doi.org/10.1063/1.5006085
Published: January 2018
View article titled, Effects of strain energy on the recrystallization within narrow metallization
Open the PDF for Effects of strain energy on the recrystallization within narrow metallization in another window
Includes: Supplementary data
Journal Articles

Quantification of local strain distributions in nanoscale strained SiGe FinFET structures

Shogo Mochizuki, Conal E. Murray, Anita Madan, Teresa Pinto, Yun-Yu Wang, Juntao Li, Weihao Weng, Hemanth Jagannathan, Yasuhiko Imai, Shigeru Kimura, Shotaro Takeuchi, Akira Sakai
Journal: Journal of Applied Physics
J. Appl. Phys. 122, 135705 (2017)
https://doi.org/10.1063/1.4991472
Published: October 2017
View article titled, Quantification of local strain distributions in nanoscale strained SiGe FinFET structures
Open the PDF for Quantification of local strain distributions in nanoscale strained SiGe FinFET structures in another window
Journal Articles

Tailoring capping layers to reduce stress gradients in copper metallization

Conal E. Murray, Deepika Priyadarshini, Son Nguyen, E. Todd Ryan
Journal: Applied Physics Letters
Appl. Phys. Lett. 109, 231907 (2016)
https://doi.org/10.1063/1.4971395
Published: December 2016
View article titled, Tailoring capping layers to reduce stress gradients in copper metallization
Open the PDF for Tailoring capping layers to reduce stress gradients in copper metallization in another window
Journal Articles

Predicting substrate resonance mode frequency shifts using conductive, through-substrate vias

Conal E. Murray, D. W. Abraham
Journal: Applied Physics Letters
Appl. Phys. Lett. 108, 084101 (2016)
https://doi.org/10.1063/1.4942453
Published: February 2016
View article titled, Predicting substrate resonance mode frequency shifts using conductive, through-substrate vias
Open the PDF for Predicting substrate resonance mode frequency shifts using conductive, through-substrate vias in another window
Journal Articles

Linking strain anisotropy and plasticity in copper metallization

Conal E. Murray, Jean Jordan-Sweet, Deepika Priyadarshini, Son Nguyen
Journal: Applied Physics Letters
Appl. Phys. Lett. 106, 181902 (2015)
https://doi.org/10.1063/1.4919788
Published: May 2015
View article titled, Linking strain anisotropy and plasticity in copper metallization
Open the PDF for Linking strain anisotropy and plasticity in copper metallization in another window
Includes: Supplementary data
Journal Articles

Origin of stress gradients induced in capped, copper metallization

Conal E. Murray
Journal: Applied Physics Letters
Appl. Phys. Lett. 104, 081920 (2014)
https://doi.org/10.1063/1.4867075
Published: February 2014
View article titled, Origin of stress gradients induced in capped, copper metallization
Open the PDF for Origin of stress gradients induced in capped, copper metallization in another window
Journal Articles

Observation of semiconductor device channel strain using in-line high resolution X-ray diffraction

Judson R. Holt, Anita Madan, Eric C. T. Harley, Matt W. Stoker, Teresa Pinto, Dominic J. Schepis, Thomas N. Adam, Conal E. Murray, Stephen W. Bedell, Martin Holt
Journal: Journal of Applied Physics
J. Appl. Phys. 114, 154502 (2013)
https://doi.org/10.1063/1.4824819
Published: October 2013
View article titled, Observation of semiconductor device channel strain using in-line high resolution X-ray diffraction
Open the PDF for Observation of semiconductor device channel strain using in-line high resolution X-ray diffraction in another window
Journal Articles

Weighted mechanical models for residual stress determination using x-ray diffraction

Conal E. Murray, Stephen W. Bedell, E. Todd Ryan
Journal: Journal of Applied Physics
J. Appl. Phys. 114, 033518 (2013)
https://doi.org/10.1063/1.4813478
Published: July 2013
View article titled, Weighted mechanical models for residual stress determination using x-ray diffraction
Open the PDF for Weighted mechanical models for residual stress determination using x-ray diffraction in another window
Journal Articles

Submicron mapping of strain distributions induced by three-dimensional through-silicon via features

Conal E. Murray, T. Graves-Abe, R. Robison, Z. Cai
Journal: Applied Physics Letters
Appl. Phys. Lett. 102, 251910 (2013)
https://doi.org/10.1063/1.4812481
Published: June 2013
View article titled, Submicron mapping of strain distributions induced by three-dimensional through-silicon via features
Open the PDF for Submicron mapping of strain distributions induced by three-dimensional through-silicon via features in another window
Journal Articles

Evolution of strain energy during recrystallization of plated Cu films

Conal E. Murray, R. Rosenberg, C. Witt, M. Treger, I. C. Noyan
Journal: Journal of Applied Physics
J. Appl. Phys. 113, 203515 (2013)
https://doi.org/10.1063/1.4807409
Published: May 2013
View article titled, Evolution of strain energy during recrystallization of plated Cu films
Open the PDF for Evolution of strain energy during recrystallization of plated Cu films in another window
Journal Articles

Equivalence of Kröner and weighted Voigt-Reuss models for x-ray stress determination

Conal E. Murray
Journal: Journal of Applied Physics
J. Appl. Phys. 113, 153509 (2013)
https://doi.org/10.1063/1.4801917
Published: April 2013
View article titled, Equivalence of Kröner and weighted Voigt-Reuss models for x-ray stress determination
Open the PDF for Equivalence of Kröner and weighted Voigt-Reuss models for x-ray stress determination in another window
Journal Articles

Mitigating residual stress in Cu metallization

Conal E. Murray, Jean Jordan-Sweet, E. Todd Ryan, Michael F. Toney
Journal: Applied Physics Letters
Appl. Phys. Lett. 101, 231906 (2012)
https://doi.org/10.1063/1.4769366
Published: December 2012
View article titled, Mitigating residual stress in Cu metallization
Open the PDF for Mitigating residual stress in Cu metallization in another window
Journal Articles

Silicide-phase evolution and platinum redistribution during silicidation of Ni0.95Pt0.05/Si(100) specimens

Praneet Adusumilli, David N. Seidman, Conal E. Murray
Journal: Journal of Applied Physics
J. Appl. Phys. 112, 064307 (2012)
https://doi.org/10.1063/1.4751023
Published: September 2012
View article titled, Silicide-phase evolution and platinum redistribution during silicidation of Ni<sub>0.95</sub>Pt<sub>0.05</sub>/Si(100) specimens
Open the PDF for Silicide-phase evolution and platinum redistribution during silicidation of Ni<sub>0.95</sub>Pt<sub>0.05</sub>/Si(100) specimens in another window
Journal Articles

Invariant x-ray elastic constants and their use in determining hydrostatic stress

Conal E. Murray
Journal: Journal of Applied Physics
J. Appl. Phys. 110, 123501 (2011)
https://doi.org/10.1063/1.3667294
Published: December 2011
View article titled, Invariant x-ray elastic constants and their use in determining hydrostatic stress
Open the PDF for Invariant x-ray elastic constants and their use in determining hydrostatic stress in another window
Journal Articles

Erratum: “Stress determination in nickel monosilicide films using x-ray diffraction” [J. Appl. Phys. 106, 073521 (2009)]

Conal E. Murray, Zhen Zhang, Christian Lavoie
Journal: Journal of Applied Physics
J. Appl. Phys. 110, 099903 (2011)
https://doi.org/10.1063/1.3660347
Published: November 2011
View article titled, Erratum: “Stress determination in nickel monosilicide films using x-ray diffraction” [J. Appl. Phys. 106, 073521 (2009)]
Open the PDF for Erratum: “Stress determination in nickel monosilicide films using x-ray diffraction” [J. Appl. Phys. 106, 073521 (2009)] in another window
Journal Articles

Nanoscale silicon-on-insulator deformation induced by stressed liner structures

Conal E. Murray, A. Ying, S. M. Polvino, I. C. Noyan, M. Holt, J. Maser
Journal: Journal of Applied Physics
J. Appl. Phys. 109, 083543 (2011)
https://doi.org/10.1063/1.3579421
Published: April 2011
View article titled, Nanoscale silicon-on-insulator deformation induced by stressed liner structures
Open the PDF for Nanoscale silicon-on-insulator deformation induced by stressed liner structures in another window
Journal Articles

Manipulating stress in Cu/low-k dielectric nanocomposites

Conal E. Murray, Paul R. Besser, E. Todd Ryan, Jean L. Jordan-Sweet
Journal: Applied Physics Letters
Appl. Phys. Lett. 98, 141916 (2011)
https://doi.org/10.1063/1.3578192
Published: April 2011
View article titled, Manipulating stress in Cu/low-k dielectric nanocomposites
Open the PDF for Manipulating stress in Cu/low-k dielectric nanocomposites in another window
Includes: Supplementary data
Journal Articles

Triaxial stress distributions in Cu/low-k interconnect features

Conal E. Murray, Paul R. Besser, E. Todd Ryan, Jean L. Jordan-Sweet
Journal: Applied Physics Letters
Appl. Phys. Lett. 98, 061908 (2011)
https://doi.org/10.1063/1.3549876
Published: February 2011
View article titled, Triaxial stress distributions in Cu/low-k interconnect features
Open the PDF for Triaxial stress distributions in Cu/low-k interconnect features in another window