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Journal Articles

Preface: Stress-Induced Phenomena and Reliability in 3D Microelectronics

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Paul S. Ho, Chao-Kun Hu, Mark Nakamoto, Shinichi Ogawa, Larry Smith, Valeriy Sukharev, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 1–2 (2014)
https://doi.org/10.1063/1.4881337
Published: June 2014
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Journal Articles

Reaction between Cu and TiSi2 across different barrier layers

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Chin‐An Chang, Chao‐Kun Hu
Journal: Applied Physics Letters
Appl. Phys. Lett. 57, 617–619 (1990)
https://doi.org/10.1063/1.104249
Published: August 1990
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Journal Articles

Atom movements of gold in lead‐tin solders

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Chao‐Kun Hu, H. B. Huntington
Journal: Journal of Applied Physics
J. Appl. Phys. 58, 2564–2569 (1985)
https://doi.org/10.1063/1.335911
Published: October 1985
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