1-20 of 47
C.-K. Hu
Close
Save search
Follow your search
Access your saved searches in your account
Close Modal
Sort by
Journal Articles

An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines

R. S. Smith, E. T. Ryan, C.-K. Hu, K. Motoyama, N. Lanzillo, D. Metzler, L. Jiang, J. Demarest, R. Quon, L. Gignac, C. Breslin, A. Giannetta, S. Wright
Journal: AIP Advances
AIP Advances 9, 025015 (2019)
https://doi.org/10.1063/1.5063896
Published: February 2019
View articletitled, An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines
Open the PDF for An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines in another window
Journal Articles

Microstructure, impurity and metal cap effects on Cu electromigration

C.-K. Hu, L. G. Gignac, J. Ohm, C. M. Breslin, E. Huang, G. Bonilla, E. Liniger, R. Rosenberg, S. Choi, A. H. Simon
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 67–78 (2014)
https://doi.org/10.1063/1.4881341
Published: June 2014
View articletitled, Microstructure, impurity and metal cap effects on Cu electromigration
Open the PDF for Microstructure, impurity and metal cap effects on Cu electromigration in another window
Journal Articles

Electromigration in Cu(Al) and Cu(Mn) damascene lines

C.-K. Hu, J. Ohm, L. M. Gignac, C. M. Breslin, S. Mittal, G. Bonilla, D. Edelstein, R. Rosenberg, S. Choi, J. J. An, A. H. Simon, M. S. Angyal, L. Clevenger, J. Maniscalco, T. Nogami, C. Penny, B. Y. Kim
Journal: Journal of Applied Physics
J. Appl. Phys. 111, 093722 (2012)
https://doi.org/10.1063/1.4711070
Published: May 2012
View articletitled, Electromigration in Cu(Al) and Cu(Mn) damascene lines
Open the PDF for Electromigration in Cu(Al) and Cu(Mn) damascene lines in another window
Journal Articles

Effect Of Impurity On Cu Electromigration

C.‐K. Hu, M. Angyal, B. C. Baker, G. Bonilla, C. Cabral, D. F. Canaperi, S. Choi, L. Clevenger, D. Edelstein, L. Gignac, E. Huang, J. Kelly, B. Y. Kim, V. Kyei‐Fordjour, S. L. Manikonda, J. Maniscalco, S. Mittal, T. Nogami, C. Parks, R. Rosenberg, A. Simon, Y. Xu, T. A. Vo, C. Witt
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 57–67 (2010)
https://doi.org/10.1063/1.3527138
Published: November 2010
View articletitled, Effect Of Impurity On Cu Electromigration
Open the PDF for Effect Of Impurity On Cu Electromigration in another window
Journal Articles

Electromigration Challenges for Nanoscale Cu Wiring

C.‐K. Hu, L. M. Gignac, E. Liniger, E. Huang, S. Greco, P. McLaughlin, C.‐C. Yang, J. J. Demarest
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1143, 3–11 (2009)
https://doi.org/10.1063/1.3169265
Published: June 2009
View articletitled, Electromigration Challenges for Nanoscale Cu Wiring
Open the PDF for Electromigration Challenges for Nanoscale Cu Wiring in another window
Journal Articles

Electromigration Reliability of Advanced Interconnects

C.‐K. Hu, L. M. Gignac, B. Baker‐O'Neal, E. Liniger, R. Yu, P. Flaitz, A. K. Stamper
Journal: AIP Conference Proceedings
AIP Conf. Proc. 945, 27–41 (2007)
https://doi.org/10.1063/1.2815782
Published: October 2007
View articletitled, Electromigration Reliability of Advanced Interconnects
Open the PDF for Electromigration Reliability of Advanced Interconnects in another window
Journal Articles

Thermal and Electromigration‐Induced Strains in Polycrystalline Films and Conductor Lines: X‐ray Microbeam Measurements and Analysis

G. S. Cargill, III, L. E. Moyer, G. Wang, H. Zhang, C.‐K. Hu, W. Yang, B. C. Larson, G. E. Ice
Journal: AIP Conference Proceedings
AIP Conf. Proc. 817, 303–309 (2006)
https://doi.org/10.1063/1.2173563
Published: February 2006
View articletitled, Thermal and Electromigration‐Induced Strains in Polycrystalline Films and Conductor Lines: X‐ray Microbeam Measurements and Analysis
Open the PDF for Thermal and Electromigration‐Induced Strains in Polycrystalline Films and Conductor Lines: X‐ray Microbeam Measurements and Analysis in another window
Journal Articles

Effect of metal liner on electromigration in Cu Damascene lines

C.-K. Hu, L. M. Gignac, E. Liniger, C. Detavernier, S. G. Malhotra, A. Simon
Journal: Journal of Applied Physics
J. Appl. Phys. 98, 124501 (2005)
https://doi.org/10.1063/1.2140872
Published: December 2005
View articletitled, Effect of metal liner on electromigration in Cu Damascene lines
Open the PDF for Effect of metal liner on electromigration in Cu Damascene lines in another window
Journal Articles

Capping Layer Effects on Electromigration in Narrow Cu Lines

C.‐K. Hu, R. Rosenberg
Journal: AIP Conference Proceedings
AIP Conf. Proc. 741, 97–111 (2004)
https://doi.org/10.1063/1.1845840
Published: December 2004
View articletitled, Capping Layer Effects on Electromigration in Narrow Cu Lines
Open the PDF for Capping Layer Effects on Electromigration in Narrow Cu Lines in another window
Journal Articles

Atom motion of Cu and Co in Cu damascene lines with a CoWP cap

C.-K. Hu, L. M. Gignac, R. Rosenberg, B. Herbst, S. Smith, J. Rubino, D. Canaperi, S. T. Chen, S. C. Seo, D. Restaino
Journal: Applied Physics Letters
Appl. Phys. Lett. 84, 4986–4988 (2004)
https://doi.org/10.1063/1.1762991
Published: June 2004
View articletitled, Atom motion of Cu and Co in Cu damascene lines with a CoWP cap
Open the PDF for Atom motion of Cu and Co in Cu damascene lines with a CoWP cap in another window
Journal Articles

Effects of failure criteria on the lifetime distribution of dual-damascene Cu line/via on W

R. F. Liu, C.-K. Hu, L. Gignac, J. M. E. Harper, J. Lloyd, X.-H. Liu, A. K. Stamper
Journal: Journal of Applied Physics
J. Appl. Phys. 95, 3737–3744 (2004)
https://doi.org/10.1063/1.1650887
Published: April 2004
View articletitled, Effects of failure criteria on the lifetime distribution of dual-damascene Cu line/via on W
Open the PDF for Effects of failure criteria on the lifetime distribution of dual-damascene Cu line/via on W in another window
Journal Articles

Nanometer precision metrology of submicron Cu/SiO 2 interconnects using fluorescence and transmission x-ray microscopy

Guangyong Xu, D. E. Eastman, B. Lai, Z. Cai, I. McNulty, S. Frigo, I. C. Noyan, C. K. Hu
Journal: Journal of Applied Physics
J. Appl. Phys. 94, 6040–6049 (2003)
https://doi.org/10.1063/1.1614430
Published: November 2003
View articletitled, Nanometer precision metrology of submicron Cu/SiO 2 interconnects using fluorescence and transmission x-ray microscopy
Open the PDF for Nanometer precision metrology of submicron Cu/SiO 2 interconnects using fluorescence and transmission x-ray microscopy in another window
Journal Articles

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

C.-K. Hu, L. Gignac, E. Liniger, B. Herbst, D. L. Rath, S. T. Chen, S. Kaldor, A. Simon, W.-T. Tseng
Journal: Applied Physics Letters
Appl. Phys. Lett. 83, 869–871 (2003)
https://doi.org/10.1063/1.1596375
Published: August 2003
View articletitled, Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
Open the PDF for Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps in another window
Journal Articles

Effect of liner thickness on electromigration lifetime

E. G. Liniger, C. -K. Hu, L. M. Gignac, A. Simon
Journal: Journal of Applied Physics
J. Appl. Phys. 93, 9576–9582 (2003)
https://doi.org/10.1063/1.1575497
Published: June 2003
View articletitled, Effect of liner thickness on electromigration lifetime
Open the PDF for Effect of liner thickness on electromigration lifetime in another window
Journal Articles

Relationship between copper concentration and stress during electromigration in an Al(0.25 at. % Cu) conductor line

H.-K. Kao, G. S. Cargill, III, F. Giuliani, C.-K. Hu
Journal: Journal of Applied Physics
J. Appl. Phys. 93, 2516–2527 (2003)
https://doi.org/10.1063/1.1539282
Published: March 2003
View articletitled, Relationship between copper concentration and stress during electromigration in an Al(0.25 at. % Cu) conductor line
Open the PDF for Relationship between copper concentration and stress during electromigration in an Al(0.25 at. % Cu) conductor line in another window
Journal Articles

Reduced electromigration of Cu wires by surface coating

C.-K. Hu, L. Gignac, R. Rosenberg, E. Liniger, J. Rubino, C. Sambucetti, A. Domenicucci, X. Chen, A. K. Stamper
Journal: Applied Physics Letters
Appl. Phys. Lett. 81, 1782–1784 (2002)
https://doi.org/10.1063/1.1504491
Published: September 2002
View articletitled, Reduced electromigration of Cu wires by surface coating
Open the PDF for Reduced electromigration of Cu wires by surface coating in another window
Journal Articles

In situ study of void growth kinetics in electroplated Cu lines

E. Liniger, L. Gignac, C.-K. Hu, S. Kaldor
Journal: Journal of Applied Physics
J. Appl. Phys. 92, 1803–1810 (2002)
https://doi.org/10.1063/1.1492871
Published: August 2002
View articletitled, In situ study of void growth kinetics in electroplated Cu lines
Open the PDF for In situ study of void growth kinetics in electroplated Cu lines in another window
Journal Articles

Real-time x-ray microbeam characterization of electromigration effects in Al(Cu) wires

P.-C. Wang, I. C. Noyan, S. K. Kaldor, J. L. Jordan-Sweet, E. G. Liniger, C.-K. Hu
Journal: Applied Physics Letters
Appl. Phys. Lett. 78, 2712–2714 (2001)
https://doi.org/10.1063/1.1368189
Published: April 2001
View articletitled, Real-time x-ray microbeam characterization of electromigration effects in Al(Cu) wires
Open the PDF for Real-time x-ray microbeam characterization of electromigration effects in Al(Cu) wires in another window
Journal Articles

Electromigration of copper in Al(0.25 at. % Cu) conductor lines

H.-K. Kao, G. S. Cargill, III, C.-K. Hu
Journal: Journal of Applied Physics
J. Appl. Phys. 89, 2588–2597 (2001)
https://doi.org/10.1063/1.1344917
Published: March 2001
View articletitled, Electromigration of copper in Al(0.25 at. % Cu) conductor lines
Open the PDF for Electromigration of copper in Al(0.25 at. % Cu) conductor lines in another window
Journal Articles

Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections

C-K. Hu, L. Gignac, S. G. Malhotra, R. Rosenberg, S. Boettcher
Journal: Applied Physics Letters
Appl. Phys. Lett. 78, 904–906 (2001)
https://doi.org/10.1063/1.1347400
Published: February 2001
View articletitled, Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
Open the PDF for Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections in another window