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Armen Kteyan
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Journal Articles

Novel physics-based tool-prototype for electromigration assessment in commercial-grade power delivery networks

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Sofya Torosyan, Armen Kteyan, Valeriy Sukharev, Jun-Ho Choy, Farid N. Najm
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 39, 013203 (2021)
https://doi.org/10.1116/6.0000617
Published: December 2020
View articletitled, Novel physics-based tool-prototype for electromigration assessment in commercial-grade power delivery networks
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Journal Articles

Advanced methodology for assessing chip package interaction effects on chip performance and reliability after chip assembly and during chip operation

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Jun-Ho Choy, Valeriy Sukharev, Armen Kteyan
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 38, 063205 (2020)
https://doi.org/10.1116/6.0000506
Published: October 2020
View articletitled, Advanced methodology for assessing chip package interaction effects on chip performance and reliability after chip assembly and during chip operation
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Journal Articles

Physics-based simulation of EM and SM in TSV-based 3D IC structures

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Armen Kteyan, Valeriy Sukharev, Ehrenfried Zschech
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1601, 114–127 (2014)
https://doi.org/10.1063/1.4881345
Published: June 2014
View articletitled, Physics-based simulation of EM and SM in TSV-based 3D IC structures
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Journal Articles

3D IC TSV‐Based Technology: Stress Assessment For Chip Performance

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Valeriy Sukharev, Armen Kteyan, Nikolay Khachatryan, Henrik Hovsepyan, Juan Andres Torres, Jun‐Ho Choy, Ara Markosian
Journal: AIP Conference Proceedings
AIP Conf. Proc. 1300, 202–213 (2010)
https://doi.org/10.1063/1.3527127
Published: November 2010
View articletitled, 3D IC TSV‐Based Technology: Stress Assessment For Chip Performance
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Journal Articles

Design specific variation in via/contact pattern transfer: Full chip analysis

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Jun-Ho Choy, Valeriy Sukharev, Ara Markosian, Armen Kteyan, Yuri Granik, Vladimir Bliznetsov
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 27, 2962–2971 (2009)
https://doi.org/10.1116/1.3253535
Published: December 2009
View articletitled, Design specific variation in via/contact pattern transfer: Full chip analysis
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