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    Aditya Karmarkar
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    Journal Articles

    TCAD modeling of stress impact on performance and reliability in 3D IC structures

    Available to Purchase
    Xiaopeng Xu, Aditya Karmarkar
    Journal: AIP Conference Proceedings
    AIP Conf. Proc. 1601, 128–137 (2014)
    https://doi.org/10.1063/1.4881346
    Published: June 2014
    Abstract
    View articletitled, TCAD modeling of stress impact on performance and reliability in 3D IC structures
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    Journal Articles

    3D TCAD Modeling For Stress Management In Through Silicon Via (TSV) Stacks

    Available to Purchase
    Xiaopeng Xu, Aditya Karmarkar
    Journal: AIP Conference Proceedings
    AIP Conf. Proc. 1378, 53–66 (2011)
    https://doi.org/10.1063/1.3615695
    Published: September 2011
    Abstract
    View articletitled, 3D TCAD Modeling For Stress Management In Through Silicon Via (TSV) Stacks
    Open the PDF for 3D TCAD Modeling For Stress Management In Through Silicon Via (TSV) Stacks in another window

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