Focus on materials, semiconductors, vacuum, and cryogenics

ICE has augmented its line of cryogen-free cryostats that take large experimental heat loads. The latest addition to the range is the Dry Ice 0.8K Benchtop Cryostat. An upgrade from the Dry Ice 1.0K Benchtop model, it combines continuous operation in the 0.8–425 K temperature range with a compact benchtop design. The Dry Ice 0.8K is a bottom-loading benchtop cryostat with a large sample space. Because it is designed to take a large experimental heat load, it is suitable for day-to-day research and quantum computing at low temperatures. Available options include sample in vacuum or exchange gas, optical access, custom wiring, and magnet choices. Integrated piezo-driven XYZ positioners, stacks, and rotators can be included. ICE Oxford, Ave Four, Station Lane, Witney, Oxford OX28 4BN, UK, www.iceoxford.com

Master Bond EP17HTS-DA is a one-component, no-mix, die attach epoxy that is electrically conductive and withstands high temperatures despite the addition of a silver filler. Typically, glass transition temperature (T_g) declines in a silver-filled system. However, with this specialty formulation, a high T_g of 140–150 °C is maintained, and it passes MIL-STD-883J thermal stability requirements at 200 °C. The strength profile of EP17HTS-DA is robust, with a die shear strength of 35–40 kg-f at room temperature. The epoxy meets NASA low-outgassing specifications, and its service temperature extends from −62 °C to 288 °C. It has a low volume resistivity of less than 0.005 Ω-cm and conducts heat well. The product bonds well to many substrates, including metals, ceramics, and plastics. Master Bond Inc, 154 Hobart St, Hackensack, NJ 07601-3922, www.masterbond.com

The Zeiss Crossbeam Laser is a line of site-specific focused-ion-beam scanning electron microscope (FIB-SEM) systems conceived to accelerate failure analysis and process optimization for advanced semiconductor packages. It integrates a femtosecond laser for speed, a gallium ion beam for accuracy, and a field-emission SEM for nanoscale-resolution imaging. In just minutes, the Zeiss Crossbeam Laser family cross-sections deeply buried package interconnects such as copper-pillar solder bumps, through silicon vias, and device back-end-of-line and front-end-of-line structures. In the process, artifacts are minimized, and sample quality under vacuum is maintained. The Zeiss Crossbeam Laser family also enables structural analysis, construction analysis, reverse engineering, FIB tomography, and sample preparation for transmission electron microscopy. Zeiss Semiconductor Manufacturing Technology, 4385 Hopyard Rd #100, Pleasanton, CA 94588, www.zeiss.com/semiconductor-manufacturing-technology

Oxford Instruments NanoScience has redeveloped its Proteox dilution refrigerator, whose interchangeable unit can support multiple users and various experiments. A side-loading “secondary insert” module lets users install and change samples, communications wiring, and signal-conditioning components. According to the company, quantum applications place increasing demands on experimental volume and wiring capacity and are a key driving factor for cryogenic innovation. The Proteox system addresses those needs through increased line-of-sight access, wider plate spacings, and a 50% increase in the mixing-chamber-plate area. By providing remote connectivity and enhanced data-visualization capabilities, a redesigned web-based control system makes the Proteox system easier to use and service. Oxford Instruments plc, Tubney Woods, Abingdon OX13 5QX, UK, https://nanoscience.oxinst.com

According to Cryogenic, the second generation of its vibrating-sample magnetometer (VSM) system, the CFM-VSM (v2), offers unique features that ensure high performance in the investigation of the electrical, magnetic, and thermal properties of materials. The VSM operates at temperatures from 1.6 K to 400 K and magnetic fields up to 9 tesla—without the need for liquid cryogens. Key enhancements include a mechanically compensated VSM drive that eliminates vibrational coupling between it and the pickup system and achieves high sensitivity for low-signal samples. To provide long-term system reliability and operation reproducibility, improved sample alignment ensures that the probe is stationary and that the sample is precisely at the center of the pickup system. The pickup system mounted rigidly to the variable temperature insert top flange makes sure the coil set is properly fixed and does not tilt away from the system axis. Cryogenic Ltd, Unit 6, Acton Park Industrial Estate, The Vale, London W3 7QE, UK, www.cryogenic.co.uk

Excillum’s NanoTube N2 60 kV and NanoTube N2 110 kV x-ray tubes deliver more power and higher voltage to achieve 150 nm resolution in geometric-magnification x-ray imaging systems. With the aim of finding and analyzing hidden features, the NanoTube N2 is targeted toward advanced industrial R&D and inspection and nondestructive testing (NDT) of components in fields such as electronics and semiconductor back-end fabrication, automotive, aerospace, and medicine. The devices have an imaging speed of 60 kV, more than three times as fast as the previous NanoTube N1. According to the company, those capabilities are key to ensuring high materials quality and research and industrial NDT efficiency. Since the NanoTube N2 features fully automated spot size control and high spot stability over time, it will be suitable for future automated inspection systems. Excillum AB, Jan Stenbecks Torg 17, 164 40 Kista, Sweden, www.excillum.com

The novel Durafuse LT alloy system from Indium Corporation provides high reliability in low-temperature applications that require a reflow temperature below 210 °C. The company claims that whereas traditional low-temperature solders often produce brittle solder joints that are susceptible to drop-shock failures, Durafuse LT offers improved drop-shock resilience and thus outclasses bismuth–tin or bismuth-tin-silver alloys. With an optimum process setup, it also performs better than Indium’s SAC305 solder. Durafuse LT is suitable for use with heat-sensitive components and flex polymers and prevents thermal warpage of processor components and multilayer boards. It meets low-temperature requirements for step soldering, particularly in RF shield attachment and rework applications. Indium Corporation, 34 Robinson Rd, Clinton, NY 13323, www.indium.com

MKS Instruments has announced the Ophir PE50U-DIFH-C pulse energy sensor. Designed for use with high-power pulsed lasers operating in demanding conditions, the sensor features materials that can measure UV radiation down to 193 nm, high repetition rates up to 10 kHz, and high energy densities up to 1 J/cm² at 193 nm and 2 J/cm² above 240 nm. Suitable for use in scientific research, medical, and semiconductor applications, the PE50U-DIFH-C energy sensor operates over a wide range of wavelengths, power levels, and repetition rates. To ensure high accuracy, it is calibrated at 193 nm, 248 nm, 355 nm, 532 nm, 1064 nm, 2100 nm, and 2940 nm. It has a 35 mm aperture and can measure energies from 10 µJ to 10 J. A special diffuser delivers the highest energy density damage threshold available, up to 90 J/cm² for millisecond pulses. MKS Instruments Inc, Ophir Business Unit (US), 3050 N 300 W, North Logan, UT 84341, www.ophiropt.com

Added to composites, carbon nanotubes can improve the mechanical, thermal, or electrical properties of a material. Goodfellow has introduced three forms of multiwalled carbon nanotubes (MWCNTs) produced by means of a catalytic chemical vapor deposition process. One form, regular powder, is available in amounts ranging from research quantities of several grams up to economical mass-production quantities of several kilos. Exclusive to Goodfellow and available in small quantities for research are “chunky” powder, which is safer and easily dispersed via sonication into a polymer matrix, and free-standing, vertically aligned MWCNT arrays, called “carpets” or “forests.” Current research involving carpets revolves around potential uses as free-standing membranes and filters, as thermal interface materials in electronic devices and supercapacitors, and as additives embedded in polymer matrices to produce novel composites. Goodfellow Corporation, 125 Hookstown Grade Rd, Coraopolis, PA 15108, www.goodfellow.com

Quantum Design and Sumitomo (SHI) Cryogenics of America have collaborated to launch a quiet, compact helium compressor for use with cryogen-free instrumentation. The R-98 double-inverter-driven helium compressor, the first in SHI’s Revolution series, is compatible with a range of SHI’s Gifford–McMahon and pulse tube two-stage cryocoolers. “Energy-smart” helium compressors can operate at variable speeds. Compared with traditional single-speed compressors, they are more energy efficient and require less servicing. Low-speed operation produces lower vibrations at the cold head and reduces noise for sensitive measuring instrumentation; high-speed operation allows for faster cooldown of the cold head. Sumitomo (SHI) Cryogenics of America Inc, 1833 Vultee St, Allentown, PA 18103, www.shicryogenics.com

ON Semiconductor has expanded its range of wide bandgap devices by introducing two additional families of silicon carbide (SiC) MOSFETs. Compared with silicon MOSFETs, the 1200 V and 900 V N-channel SiC MOSFETs deliver faster switching performance, enhanced reliability, and greater robustness, according to the company. A fast intrinsic diode with low reverse recovery charge significantly reduces power losses, boosts operating frequencies, and increases the power density of the overall system. High-frequency operation is further enhanced by the small chip size, which lowers device capacitance and reduces gate charge to as low as 220 nC. Besides reducing switching losses, those enhancements improve efficiency, reduce electromagnetic interference when compared with silicon MOSFETs, and allow fewer and smaller passive components to be used. ON Semiconductor, 5005 E McDowell Rd, Phoenix, AZ 85008, www.onsemi.com