The enormous number of successful applications of thin films for a large variety of scientific, engineering and industrial purposes is in large measure due to the rapidly increasing scientific understanding of the nature of the processes used to deposit thin films. Remarkable advances have been made, especially over the last decade, both in the understanding of older processes and in the development of new ones to satisfy new, and ever more sophisticated, needs. This special issue of PHYSICS TODAY includes representative articles on thin‐film processes, analytic techniques and applications.
Topics
Thin films
REFERENCES
1.
J. L. Vossen, W. Kern, eds., Thin Film Processes, Academic, New York (1978).
2.
L. I. Maissel, R. Glang, eds., Handbook of Thin Film Technology, McGraw‐Hill, New York (1970).
3.
S. Dushman, J. M. Lafferty, Scientific Foundations of Vacuum Technology, 2nd edition, Wiley, New York (1962).
4.
5.
6.
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8.
9.
J. F. O'Hanlon, in Oxides and Oxide Films, A. K. Vijh, ed., Volume 5, page 1, Dekker, New York (1977).
10.
11.
T. O. Sedgewick, H. Lydtin, eds., Chemical Vapor Deposition 1979, Proc. Seventh Internatl. Conf., The Electrochemical Soc., Inc. Princeton, New Jersey (1979).
(See also previous volumes of this series published in 1970, 1972, 1973, 1975 and 1977).
12.
13.
J. W. Matthews, ed., Epitaxial Growth, Parts A and B, Academic, New York (1975).
14.
C. T. Powell, J. H. Oxley, J. M. Blocher, Jr., eds., Vapor Deposition, Wiley, New York (1966).
15.
E. Yeager, A. J. Salking, Techniques of Electrochemistry, Volume 3, Wiley‐Interscience, New York (1978);
F. A. Lowenheim, ed., Modern Electroplating, 3rd ed., Wiley‐Interscience, New York (1974);
G. L.
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B. N. Chapman, J. C. Anderson, eds., Science and Technology of Surface Coating, Academic, London (1974).
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© 1980 American Institute of Physics.
1980
American Institute of Physics
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