The use of short and ultrashort pulse lasers for laser micromachining of silicon is now a well advanced manufacturing technique. Applications include semiconductor wafer dicing, inkjet printhead slotting, and substrate structuring for solar cell production. A key element of the laser machining process is the role of the ambient or assist media in relation to enhancing the ablation rate, minimising the negative impact of debris generation, and functionalising the laser generated particulate. This paper will present results of research work focused on the impact of assist media, in particular the use of water, non-polar liquids, and halocarbon gases, in laser micromachining of silicon. Novel observations related to the laser induced liquefaction of assist gases will also be presented.
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Pacific International Conference on Applications of Lasers and Optics
March 23–25, 2010
Wuhan, People’s Republic of China
ISBN:
978-0-912035-56-7
PROCEEDINGS PAPER
Laser micromachining of silicon substrates: Investigation and utilisation of assist media
Alan Conneely;
Alan Conneely
National Centre for Laser Applications
, NUI Galway, Galway, Ireland
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Sedao;
Sedao
National Centre for Laser Applications
, NUI Galway, Galway, Ireland
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Natalie Haustrup;
Natalie Haustrup
National Centre for Laser Applications
, NUI Galway, Galway, Ireland
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Gerard M. O’Connor
Gerard M. O’Connor
National Centre for Laser Applications
, NUI Galway, Galway, Ireland
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Published Online:
September 01 2010
Citation
Alan Conneely, Sedao, Natalie Haustrup, Gerard M. O’Connor; March 23–25, 2010. "Laser micromachining of silicon substrates: Investigation and utilisation of assist media." Proceedings of the Pacific International Conference on Applications of Lasers and Optics. PICALO 2010: 4th Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication. Wuhan, People’s Republic of China. (pp. pp. 997-1004). ASME. https://doi.org/10.2351/1.5062150
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