The use of a laser-assisted process for direct writing of copper films and coatings has significant potential for several applications within the electronics industry. Experiments were conducted using a pulsed Nd:YAG (1064 nm) laser to irradiate a metallo-organic precursor film that had been predeposited onto glass and FR-4 substrates. Parameters that were investigated included irradiation wavelength, pulsing conditions, precursor thickness, and the use of inert and active shielding gas. Scanning electron microscopy, energy dispersive x-ray spectroscopy, and electrical resistivity measurements were used to characterize the processed specimens. Initial results of these experiments indicated that Nd:YAG irradiation resulted in decomposition of the precursor and deposition of copper; although, the crystalline deposits contained varying levels of oxide. It is believed that the decomposition mechanism is pyrolytic.
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Pacific International Conference on Applications of Lasers and Optics
March 23–25, 2010
Wuhan, People’s Republic of China
ISBN:
978-0-912035-76-5
PROCEEDINGS PAPER
Laser-assisted writing of copper films through Nd:YAG laser radiation
R. Martukanitz;
R. Martukanitz
1
Applied Research Laboratory, Pennsylvania State University
, State College, PA 16804, USA
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R. Harster;
R. Harster
2
Department of Electrical Engineering, Princeton University
, Princeton, NJ 08544, USA
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D. Conklin;
D. Conklin
2
Department of Electrical Engineering, Princeton University
, Princeton, NJ 08544, USA
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S. Wagner
S. Wagner
2
Department of Electrical Engineering, Princeton University
, Princeton, NJ 08544, USA
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Published Online:
October 01 2004
Citation
R. Martukanitz, R. Harster, D. Conklin, S. Wagner; March 23–25, 2010. "Laser-assisted writing of copper films through Nd:YAG laser radiation." Proceedings of the Pacific International Conference on Applications of Lasers and Optics. PICALO 2004: 1st Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication. Wuhan, People’s Republic of China. (pp. 1801). ASME. https://doi.org/10.2351/1.5060235
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