We demonstrate an all-fiber-amplifier, MOPA architecture supporting variable pulse repetition frequencies and pulse widths. The system operates at near infrared wavelengths of ∼1064 nm and supports pulse repetition frequencies up to 2 MHz and pulse widths as short as 2 ns. The amplifier output is polarized with a narrow spectral width and a diffraction limited spatial mode allowing efficient harmonic generation. Bulk LBO crystals are used to generate the second and third harmonic output. We have demonstrated average fundamental, second harmonic, and third harmonic powers of 66 W, 43 W, and 30 W, respectively. A turnkey system using this architecture is commercially available and has rated output powers slightly less than half these values. The system is entirely air-cooled and operates from a standard wall plug electric service, facilitating integration into various applications. Exemplary precision material processing applications will be discussed.

1.
Baird
,
B. W.
Hainsey
,
R. F.
,
Peng
,
X.
, &
Pirogovsky
,
P.Y.
(
2007
)
Advances in Laser Processing of Microelectronics
,
Proc. SPIE
,
6451
,
64511K
.
2.
Leonardo
,
M. J.
,
Byer
,
M. W.
,
Keaton
,
G. L.
,
Richard
,
D. J.
,
Adams
,
F. J.
,
Nightingale
,
J. L.
,
Arbore
,
M. A.
,
Guzsella
,
S.
, &
Smoliar
,
L. A.
, (
2009
)
Fiber amplifier based UV laser source
,
Proc. SPIE
,
7195
,
71950F
.
3.
Herfurth
,
H.
,
Patwa
,
R.
,
Lauterborn
,
T.
,
Heinemann
,
S.
, &
Pantsar
,
H.
, (
2007
)
Micromachining with tailored nanosecond pulses
,
Proc. SPIE
,
6796
,
67961G
.
4.
O’Neill
,
W.
&
Li
,
K.
, (
2009
)
High-quality micromachining of silicon at 1064 nm using a highbrightness MOPA-based 20-W Yb fiber laser
,
IEEE J. of Quantum Electronics
,
15
(
2
),
462
.
5.
Koplow
,
J.
,
Kliner
,
D.
, &
Goldberg
,
L.
, (
1998
)
UV Generation by Frequency Quadrupling of a Yb-Doped Fiber Amplifier
,
IEEE Photonics Tech. Letts.
,
10
(
1
),
75
.
6.
Byer
,
M. W.
&
Leonardo
,
M. J.
, (
2008
)
Reducing Thermal Load on Optical Head
, U.S. Patent #7,469,081.
7.
Leonardo
,
M. J.
,
Byer
,
M. W.
, &
Smoliar
,
L. A.
, (
2008
)
Laser Apparatus having Multiple Synchronous Amplifiers Tied to One Master Oscillator
, U.S. Patent #7,443,903.
8.
Hong
,
M. H.
,
Xie
,
Q.
,
Tiaw
,
K. S.
, &
Chong
,
T. C.
, (
2005
)
Laser singulation of thin wafers & difficult processed substrates: A niche area over saw dicing
,
Proc. of 6ᵗʰ International Laser Precision Manufacturing Conf
.
9.
Panzner
,
M.
,
Kasper
,
J.
,
Hendrik
,
W.
,
Klotzbach
,
U.
&
Beyer
,
E.
, (
2002
)
Processing of silicon by Nd:YAG-lasers with harmonics generation
,
Proc. SPIE
,
4637
,
296
.
10.
Toftness
,
R.
,
Boyle
,
A.
, &
Gillen
,
D.
, (
2005
)
Laser technology for wafer dicing and microvia drilling for next generation wafers
,
Proc. SPIE
,
5713
,
54
.
11.
Haupt
,
O.
,
Siegel
,
F.
,
Schoonderbeek
,
A.
,
Richter
,
L.
,
Kling
,
R.
, &
Ostendorf
,
A.
, (
2008
)
Laser dicing of silicon: Comparison of ablation mechanisms with a novel technology of thermally induced stress
,
Proc. of 9ᵗʰ International Laser Precision Manufacturing Conf
.
12.
Shah
,
L.
,
Monro
,
K.
, &
Cho
,
G. C.
(
2008
)
Ultrafast fiber lasers: Femtosecond fiber laser enable reliable wafer-level processing
,
Laser Focus World
,
44
(
12
),
61
.
13.
Migliore
,
L.
,
Lee
,
K-S
,.
Jeong-Moog
,
K.
,
Byung-Kew
,
C.
, (
2006
)
Advances in laser singulation of silicon
,
ICALEO® 2006 Congress Proceedings
,
237
.
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