We investigate two laser processes for surface texturing of silicon solar cells. One uses direct laser ablation of Si of the as-cut wafers without any masking technique. The other process structures a dielectric layer that is subsequently used as an etching mask. Both texturing processes combine laser structuring and wet chemical etching. Besides a spot-wise scanning process using a solid state laser system that features a galvo scanner, also an imaging technique based on an excimer laser is applied. With both approaches we achieve a homogeneous, honeycomb-like texture on the silicon wafer surface. The approach with the excimer laser is economically more attractive due to a substantially higher throughput.

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