We investigate two laser processes for surface texturing of silicon solar cells. One uses direct laser ablation of Si of the as-cut wafers without any masking technique. The other process structures a dielectric layer that is subsequently used as an etching mask. Both texturing processes combine laser structuring and wet chemical etching. Besides a spot-wise scanning process using a solid state laser system that features a galvo scanner, also an imaging technique based on an excimer laser is applied. With both approaches we achieve a homogeneous, honeycomb-like texture on the silicon wafer surface. The approach with the excimer laser is economically more attractive due to a substantially higher throughput.
Laser surface texturing for reducing reflection losses in multicristalline silicon solar cells
R. Grischke, B. Terheiden, S. Mau, N.-P. Harder, A. Schoonderbeek, R. Kling, A. Ostendorf, B. Denkena, R. Brendel; November 27–30, 1990. "Laser surface texturing for reducing reflection losses in multicristalline silicon solar cells." Proceedings of the International Laser Safety Conference. ICALEO® 2007: 26th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Cincinnati, Ohio, USA. (pp. 305). ASME. https://doi.org/10.2351/1.5061062
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