This paper focuses on precision machining of transparent materials by means of ablative and non-ablative femtosecond laser processing. Ablation technology will be compared with a newly developed patent pending non-ablative femtosecond process, ClearShape™, using the Spectra-Physics® Spirit® industrial femtosecond laser.

1.
Chichkov
,
B.N.
,
Momma
,
C.
,
Nolte
,
S.
,
von Alvensleben
,
F.
,
Tünnermann
,
A.
(
1996
)
Femtosecond picosecond and nanosecond laser ablation of solids
,
Applied Physics A
63
,
109
115
.
2.
Chien
,
C.Y.
,
Gupta
,
M.C.
(
2005
)
Pulse width effect in ultrafast laser processing of material
,
Applied Physics A: Materials Science & Processing
81
,
1257
1263
.
3.
Dausinger
,
F.
,
Lichter
,
F.
,
Lubatschowski
,
H.
(
2004
) Femtosecond Technology for Technical and Medical Applications,
Springer
.
4.
König
,
J.
,
Nolte
,
S.
,
Tünnermann
,
A.
(
2005
)
Plasma evalution during metal ablation with ultrashort laser pulses
,
Optics Express
13
,
10597
10607
.
5.
Momma
,
C.
,
Chichkov
,
B.N.
,
Nolte
,
S.
,
von Alvensleben
,
F.
,
Tünnermann
,
A.
,
Welling
,
H.
,
Wellegehausen
,
B.
(
1996
)
Short-pulse laser ablation of solid targets
,
Optics Communications
129
,
134
142
.
6.
Li
,
Y.
,
Latham
,
W.P.
,
Kar
,
A.
(
2001
)
Lumped parameter model for multimode laser cutting
,
Optics and Lasers in Engineering
35
,
371
386
.
7.
Tseng
,
A.A.
,
Chen
,
Y.-T.
,
Ma
,
K.-J.
(
2004
)
Fabrication of high-aspect-ratio microstructures using excimer laser
,
Optics and Lasers in Engineering
41
,
827
847
.
8.
Schille
,
J.
,
Schneider
,
L.
,
Loeschner
,
U.
,
Ebert
,
R.
,
Scully
,
P.
,
Goddard
,
N.
,
Steiger
,
B.
,
Exner
,
H.
(
2011
) Micro processing of metals using a high repetition rate femtosecond laser: from laser process parameter study to machining examples. in
Proceeding of ICALEO
2011.
Orlando
,
FL, USA
.
9.
Hendricks
,
F.
,
Aus der Au
,
J.
,
Matylitsky
,
V.V.
(
2014
)
High Aspect Ratio Microstructuring of Transparent Dielectrics using Femtosecond Laser Pulses: Method for Optimization of the Machining Throughput
,
Appl. Phys. A
117
,
149
153
.
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