Microscale laser peen forming (μLPF) is a novel laser micro-forming technology which utilizes the shock wave induced by the transient, intense laser pulse to generate plastic deformation of metals to achieve complex figurations of MEMS components. In the present paper, a numerical analysis model was implemented to calculate the dynamic response of copper foils in μLPF. The orthogonal experimental design L9 (34) was employed to estimate the influence of technological parameters on the deformation degree of copper foils under μLPF. The sample thickness, the laser energy and the laser spot size were selected as experimental factors. According to the range analysis, the sample thickness was the most sensitive factor for the dome height of samples. The influence of different parameters on the dome height was evaluated by the level current graph. The optimal matching of technological parameters was also obtained.

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