Microscale laser peen forming (μLPF) has attracted much attention as an outstanding laser processing technology for it can be employed to fabricate 3D micro parts and impart compressive residual stresses in the target. This article presents a new numerical approach to describing the elastic-plastic behavior of polycrystalline copper foils under μLPF based on crystal plasticity finite element method (CPFEM). In this way the material was divided into a set of sub-continua, and each sub-continuum was assumed to be a grain and anisotropic. The overall properties of the polycrystalline aggregate were determined by the number of grains and their orientations. A user-material subroutine (UMAT) was incorporated into ABAQUS/Standard to implement this approach. Then the numerical approach was applied to polycrystal copper under the tensile test and μLPF. From simulations, the presented method can carry out the deformation behavior of metals induced by laser-generated shock waves.

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