Research on single pass laser crack-free cutting of thick and dense ceramics Available to Purchase

Laser crack-free cutting of thick and dense ceramics (thickness > 10 mm, relative density ≥ 98%) by single pass which is based on continuous piercing through the work-piece was presented in this paper. With two processing stages matching with appropriate time shot for every piercing, low cycle duty, low gas pressure and other processing parameters, the crack-free internal straight or curve shape cutting of the ceramics could be obtained by CO₂ laser at higher cutting speed of about 25 ∼ 30 mm/min. Combining with the analysis of the power flowing intensity and heat accumulation effects around laser spot, it is concluded that the non-equilibrium heat accumulation was inhibited effectively by the single pass laser crack-free cutting technique. For cutting of 10 mm thick Al₂O₃ ceramic, the total time without power flowing between the fore-piercing and the next-piercing by the technique could be ∼600 ms, which combined with ejecting of melting materials, could supply enough cooling time to inhibit the non-equilibrium heat accumulation resulting in cracks.