Laser crack-free cutting of thick and dense ceramics (thickness > 10 mm, relative density ≥ 98%) by single pass which is based on continuous piercing through the work-piece was presented in this paper. With two processing stages matching with appropriate time shot for every piercing, low cycle duty, low gas pressure and other processing parameters, the crack-free internal straight or curve shape cutting of the ceramics could be obtained by CO2 laser at higher cutting speed of about 25 ∼ 30 mm/min. Combining with the analysis of the power flowing intensity and heat accumulation effects around laser spot, it is concluded that the non-equilibrium heat accumulation was inhibited effectively by the single pass laser crack-free cutting technique. For cutting of 10 mm thick Al2O3 ceramic, the total time without power flowing between the fore-piercing and the next-piercing by the technique could be ∼600 ms, which combined with ejecting of melting materials, could supply enough cooling time to inhibit the non-equilibrium heat accumulation resulting in cracks.
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4th Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication
March 23–25, 2010
Wuhan, People's Republic of China
ISBN:
978-0-912035-56-7
PROCEEDINGS PAPER
Research on single pass laser crack-free cutting of thick and dense ceramics Available to Purchase
Lingfei Ji;
Lingfei Ji
Institute of Laser Engineering, Beijing University of Technology
, Beijing 100022, People’s Republic of China
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Yinzhou Yan;
Yinzhou Yan
Institute of Laser Engineering, Beijing University of Technology
, Beijing 100022, People’s Republic of China
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Yong Bao;
Yong Bao
Institute of Laser Engineering, Beijing University of Technology
, Beijing 100022, People’s Republic of China
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Yijian Jiang
Yijian Jiang
Institute of Laser Engineering, Beijing University of Technology
, Beijing 100022, People’s Republic of China
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Published Online:
March 01 2010
Citation
Lingfei Ji, Yinzhou Yan, Yong Bao, Yijian Jiang; March 23–25, 2010. "Research on single pass laser crack-free cutting of thick and dense ceramics." Proceedings of the 4th Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication. PICALO 2010: 4th Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication. Wuhan, People's Republic of China. (pp. 106). ASME. https://doi.org/10.2351/1.5057178
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