A line-shape laser was applied to reduce the thermal stress in glass laser cutting with melting method. The mathematical model was put forward, and the temperature and the thermal stress fields were calculated by using Finite-Element-Method (FEM) software ANSYS. Through numerical studies, it was concluded that with the aid of the line-shape laser, the value of the thermal stress induced in glass could be controlled below the critical value, and the glass could be cut in melting method. The experimental results showed that with the aid of the line-shape laser, the cutting quality can be improved greatly comparing with that by a focused laser beam alone, and there were no fracture trails on the cutting profile comparing with that cutting glass with the controlled fracture method. However, there were few cross cracks induced by the residual stress after the laser cutting in melting method, which needs a further studied.
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4th Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication
March 23–25, 2010
Wuhan, People's Republic of China
ISBN:
978-0-912035-56-7
PROCEEDINGS PAPER
Cutting glass substrates in melting means with dual laser beams
Junke Jiao;
Junke Jiao
1
Institute of Industry Technology, Guangzhou and Chinese Academy of Sciences
, Guangzhou 511458, China
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Xinbing Wang;
Xinbing Wang
2
Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology
, Wuhan, 430074, China
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Changwen Peng;
Changwen Peng
1
Institute of Industry Technology, Guangzhou and Chinese Academy of Sciences
, Guangzhou 511458, China
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Xiaobo Bai;
Xiaobo Bai
1
Institute of Industry Technology, Guangzhou and Chinese Academy of Sciences
, Guangzhou 511458, China
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Ju Dai
Ju Dai
1
Institute of Industry Technology, Guangzhou and Chinese Academy of Sciences
, Guangzhou 511458, China
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Published Online:
March 01 2010
Citation
Junke Jiao, Xinbing Wang, Changwen Peng, Xiaobo Bai, Ju Dai; March 23–25, 2010. "Cutting glass substrates in melting means with dual laser beams." Proceedings of the 4th Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication. PICALO 2010: 4th Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication. Wuhan, People's Republic of China. (pp. 105). ASME. https://doi.org/10.2351/1.5057177
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