Nd:YAG laser and micropen integrated fabrication of MIM thick film capacitors

With rapid development of the electronic industry, how to respond the market requests quickly, shorten R&D prototyping fabrication period, and reduce the cost of the electronic devices have become a challenge work, which need flexible manufacturing methods. In this work, two direct-write processing methods, i.e. direct material deposition by micropen and Nd:YAG laser micro cladding, are integrated with CAD/CAM technology for the hybrid fabrication of passive electronic components. Especially, the Metal-Insulator-Metal (MIM) type thick film capacitors are fabricated on ceramic substrates by this method. A basic two-step procedure of laser micro cladding electronic pastes (LMCEP) process for the thick film pattern preparation is presented. Multilayer structure and properties are demonstrated and discussed. The results of the frequency characteristics test show the MIM thick film capacitors fabricated by the LMCEP process have good DC voltage stability, good frequency stability and low dissipation factor.