Laser cleaning of micron and sub-micron particles from various substrates such as silicon wafers and glass has been an active area of research in laser processing [1]. Both understanding the fundamental physics of the light/particle/surface interaction and the development of successful cleaning protocols for industrial application have been drivers. It has been observed that directing the laser beam through a semi-transparent or transparent sample can give a higher laser cleaning efficiency for a given laser fluence than does front laser irradiation [2]. In this work we present new comparative experimental results of “front and back” laser cleaning of silica particles from silica and glass substrates. Also, a comparison is made of the optical damage that occurs at higher laser fluences, beyond the damage free laser cleaning limit, for both.

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Y. W.
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D M
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World Scientific
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13.
Kromasil website with the details of the SM
: http://www.kromasil.com/products/products/kromasil/index.htm
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Joyce
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A. M.
,
Kane
,
D. M
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Chater
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R. J.
,
to be
published
(
2006
), “
Optical surface profilometry of low reflectance materials – evaluation as a laser processing diagnostic”, in this
Proceedings of the 2nd Pacific International Conference on Application of Lasers and Optics
.
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