Laser cleaning of micron and sub-micron particles from various substrates such as silicon wafers and glass has been an active area of research in laser processing [1]. Both understanding the fundamental physics of the light/particle/surface interaction and the development of successful cleaning protocols for industrial application have been drivers. It has been observed that directing the laser beam through a semi-transparent or transparent sample can give a higher laser cleaning efficiency for a given laser fluence than does front laser irradiation [2]. In this work we present new comparative experimental results of “front and back” laser cleaning of silica particles from silica and glass substrates. Also, a comparison is made of the optical damage that occurs at higher laser fluences, beyond the damage free laser cleaning limit, for both.
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2nd Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication
April 3–5, 2006
Melbourne, Australia
ISBN:
978-0-912035-84-0
PROCEEDINGS PAPER
Comparison of front and back laser irradiation in laser cleaning of silica particles from silica glass Available to Purchase
Adam M. Joyce;
Adam M. Joyce
Department of Physics, Macquarie University∼Sydney
, NSW 2109, Australia
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Deborah M. Kane
Deborah M. Kane
Department of Physics, Macquarie University∼Sydney
, NSW 2109, Australia
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Published Online:
April 01 2006
Citation
Adam M. Joyce, Deborah M. Kane; April 3–5, 2006. "Comparison of front and back laser irradiation in laser cleaning of silica particles from silica glass." Proceedings of the 2nd Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication. PICALO 2006: 2nd Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication. Melbourne, Australia. (pp. pp. 299-304). ASME. https://doi.org/10.2351/1.5056947
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