Direct formation of pure copper layer on aluminum nitride by multibeam laser deposition with blue diode lasers

A demand of power module devices has been increasing for highly energy efficient social system. The insulated heat sink printed circuit board is the key component of power module devices, which is composed of copper and aluminum nitride (AlN) due to high thermal conductivity. The conventional method of the joining between copper and AlN is active metal brazing method, but there is an issue that the high heat treatment of this method generates thermal residual stress on the board and decrease the reliability. For that reason, the development of a direct bonding process between copper and AlN has been demanded. Therefore, we focused on the laser metal deposition (LMD) method, which is a selective heating and microfabrication process. The LMD method is a method in which a powder material is supplied to the processing point and irradiated with a laser to melt the powder and form layer on the surface of the substrate. Then, a blue diode laser with a wavelength of 450 nm, which has a high absorptivity of 60% for copper, is used as a heat source. In addition, the multibeam type LMD system has been installed for the uniform heating of powder. In this study, the laser power density, laser scanning speed, and powder feeding rate were changed to explore the conditions for forming a copper layer on the AlN substrate.