A demand of power module devices has been increasing for highly energy efficient social system. The insulated heat sink printed circuit board is the key component of power module devices, which is composed of copper and aluminum nitride (AlN) due to high thermal conductivity. The conventional method of the joining between copper and AlN is active metal brazing method, but there is an issue that the high heat treatment of this method generates thermal residual stress on the board and decrease the reliability. For that reason, the development of a direct bonding process between copper and AlN has been demanded. Therefore, we focused on the laser metal deposition (LMD) method, which is a selective heating and microfabrication process. The LMD method is a method in which a powder material is supplied to the processing point and irradiated with a laser to melt the powder and form layer on the surface of the substrate. Then, a blue diode laser with a wavelength of 450 nm, which has a high absorptivity of 60% for copper, is used as a heat source. In addition, the multibeam type LMD system has been installed for the uniform heating of powder. In this study, the laser power density, laser scanning speed, and powder feeding rate were changed to explore the conditions for forming a copper layer on the AlN substrate.
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November 2024
Research Article|
October 14 2024
Direct formation of pure copper layer on aluminum nitride by multibeam laser deposition with blue diode lasers
Keisuke Takenaka
;
Keisuke Takenaka
(Formal analysis, Writing – original draft)
1
Joining and Welding Research Institute, Osaka University
, 11-1, Mihogaoka, Ibaraki, Osaka 567-0047, Japan
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Jumpei Tokumoto
;
Jumpei Tokumoto
(Data curation, Investigation)
1
Joining and Welding Research Institute, Osaka University
, 11-1, Mihogaoka, Ibaraki, Osaka 567-0047, Japan
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Koji Kobayashi;
Koji Kobayashi
(Investigation)
2
Dowa Power Device Co., Ltd.
, 9637-3, Kataoka, Shiojiri, Nagano 399-0711, Japan
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Hideyo Osanai;
Hideyo Osanai
(Project administration)
2
Dowa Power Device Co., Ltd.
, 9637-3, Kataoka, Shiojiri, Nagano 399-0711, Japan
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Koji Toji
;
Koji Toji
(Project administration)
3
Shimadzu Corporation
, 1, Nishinokyo Kuwabara, Nakagyo, Kyoto 604-8511, Japan
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Yuji Sato
;
Yuji Sato
(Investigation, Writing – review & editing)
1
Joining and Welding Research Institute, Osaka University
, 11-1, Mihogaoka, Ibaraki, Osaka 567-0047, Japan
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Masahiro Tsukamoto
Masahiro Tsukamoto
(Project administration, Writing – review & editing)
1
Joining and Welding Research Institute, Osaka University
, 11-1, Mihogaoka, Ibaraki, Osaka 567-0047, Japan
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J. Laser Appl. 36, 042043 (2024)
Article history
Received:
July 23 2024
Accepted:
September 10 2024
Citation
Keisuke Takenaka, Jumpei Tokumoto, Koji Kobayashi, Hideyo Osanai, Koji Toji, Yuji Sato, Masahiro Tsukamoto; Direct formation of pure copper layer on aluminum nitride by multibeam laser deposition with blue diode lasers. J. Laser Appl. 1 November 2024; 36 (4): 042043. https://doi.org/10.2351/7.0001645
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