Development workflow based on in situ synchrotron investigations to optimize laser processing of copper pins

To design future laser manufacturing processes for welding of copper materials, more and more high-end analysis methods are required. A fundamental process understanding by analyzing cause-and-effect relations of process dynamics using inline in situ diagnostics allows for an improved description of laser material interaction. Strategies for a reliable and robust welding process are derived from the findings. In this study, a four-step advanced methodical approach is presented and discussed. In the first step, a fundamental process description of the geometry of the vapor capillary and the formation of weld defects is developed. Therefore, welds on electrolytic tough pitch copper (Cu-ETP) and CuSn₆ are carried out to analyze the temporal and spatial vapor capillary dynamics depending on laser power, welding speed, and focal diameter. This fundamental process understanding is transferred to the welding of copper pins in the form of I-pins. For this purpose, impurities and imperfections were applied to the pin surface to investigate the effects on the process result. As a third step, strategies by means of laser intensity distributions were adapted to compensate for imperfections in the welding process. Finally, a sensor vision system is adapted for ideal welding results. Investigations are based on in situ synchrotron analysis at Petra III, DESY in Hamburg. For the experiments, a TRUMPF TruDisk laser (100/400 μm fiber diameter), a TRUMPF TruFiber 6000P (50/100 μm fiber diameter), and a single-mode fiber laser (14 μm fiber diameter) were used. The focal diameter was adjusted with the optical system depending on the investigation.