With the increasing of miniaturization and functionalization of portable equipment such as mobile phone and note personal computer, it is highly demanded to make the wiring boards thinner and more integrated. In drilling processing on the wiring boards the Nd-YAG laser is paid attention, because it has short wave length and exceeds CO2, which have been used in practice, in stability and control character. In this study, the influence of processing condition such as laser power, irradiating time, number of laser shot and focal position on the shape of hole is discussed for a practical board. The results have indicated that YAG laser is applicable in drilling on the board via setting up proper processing condition for the different board.

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© 2000 Laser Institute of America.
2000
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