Light emission was detected by a multi-photosensor system consist of ten photo-diodes with different aiming angles between 0 and 86 degree to distinguish the light intensities emitted from plume, keyhole opening and the finger part of keyhole. Bead-on-plate welding of thick sheets with a CO2 laser of 20 kW power level was carried out at different laser powers and welding velocities. It was found that the light emission from the finger part was much smaller than that from the keyhole opening. The power spectrum of the light emission from the finger part was correlated to the penetration depth based on an empirical formula. The thus estimated penetration depth is found to agree well with the experimental penetration depth at various test conditions.
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ICALEO '99: Proceedings of the Laser Microfabrication Conference
November 15–17, 1999
San Diego, California, USA
ISBN:
0-912035-60-9
PROCEEDINGS PAPER
In-process monitoring of penetration depth in 20kW-class CO2 Laser welding of thick sections Available to Purchase
Takashi Inoue;
Takashi Inoue
*
Department of Manufacturing Science, Graduate school of Engineering, Osaka University
, Osaka, 565-0871, Japan
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Isamu Miyamoto;
Isamu Miyamoto
*
Department of Manufacturing Science, Graduate school of Engineering, Osaka University
, Osaka, 565-0871, Japan
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Kazuhiko Ono;
Kazuhiko Ono
**
Manufacturing Engineering Development Center Production Division, Komatsu Ltd.
, Osaka, 573-1011, Japan
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Kaoru Adachi;
Kaoru Adachi
**
Manufacturing Engineering Development Center Production Division, Komatsu Ltd.
, Osaka, 573-1011, Japan
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Yasuichi Matsumoto
Yasuichi Matsumoto
**
Manufacturing Engineering Development Center Production Division, Komatsu Ltd.
, Osaka, 573-1011, Japan
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Published Online:
November 01 1999
Citation
Takashi Inoue, Isamu Miyamoto, Kazuhiko Ono, Kaoru Adachi, Yasuichi Matsumoto; November 15–17, 1999. "In-process monitoring of penetration depth in 20kW-class CO2 Laser welding of thick sections." Proceedings of the ICALEO '99: Proceedings of the Laser Microfabrication Conference. ICALEO '99: Proceedings of the Laser Materials Processing Conference. San Diego, California, USA. (pp. pp. E34-E42). ASME. https://doi.org/10.2351/1.5059252
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