The suitability of picosecond laser pulses for drilling holes in Si3N4, SiC and Polyimid is investigated. The drilling of ceramics requires pulses of high energy. Laser radiation is focused to spot diameters smaller than 10 μm, yielding power densities up to 5 × 1012 W/cm2 at the sample surface. The threshold fluences for ablation and the removal depth per pulse are determinated for 35 ps pulses. In SiC holes were drilled with diameters smaller than 6 μm by a wavelength of 532 nm. Holes in Polyimid are produced with diameters of 5 μm. The influence of pulse energy and laser wavelength (fundamental, SHG, THG) on material removal is discussed.

Topics
Lasers, Carbides, Chemical compounds, Ceramics
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© 1997 Laser Institute of America.
1997
Laser Institute of America
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