This paper reports on work exploring the feasibility of a range of materials processing applications using a Diomed 60W diode laser delivered through a 600μm diameter optical fibre to a 3 axis CNC workstation. The applications studied include: marking/engraving natural stones (marble and granite), marking ceramic tiles, sealing tile grouts, cutting and marking glass, marking/engraving wood, stripping paint and lacquer, and welding metallic wires. The study shows that even at the present limited power level of diode lasers, many materials processing applications can be accomplished with satisfactory results. Through the study an initial understanding of interaction of high power diode laser (HPDL) beam with various materials has been gained. Also, within the paper basic beam characteristics, and current R&D activities in HPDL technology and materials processing applications are reviewed.
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ICALEO '96: Proceedings of the Laser Materials Processing Conference
October 14–17, 1996
Detroit, Michigan, USA
ISBN:
978-0-912035-54-3
PROCEEDINGS PAPER
Materials processing with a high power diode laser Available to Purchase
L. Li;
L. Li
*
Manufacturing Division, Dept. of Mechanical Engineering
, UMIST, Sackville Street, Manchester M60 1QD, UK
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J. Lawrence;
J. Lawrence
*
Manufacturing Division, Dept. of Mechanical Engineering
, UMIST, Sackville Street, Manchester M60 1QD, UK
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J. T. Spencer
J. T. Spencer
*
Manufacturing Division, Dept. of Mechanical Engineering
, UMIST, Sackville Street, Manchester M60 1QD, UK
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Published Online:
October 01 1996
Citation
L. Li, J. Lawrence, J. T. Spencer; October 14–17, 1996. "Materials processing with a high power diode laser." Proceedings of the ICALEO '96: Proceedings of the Laser Materials Processing Conference. ICALEO '96: Proceedings of the Laser Materials Processing Conference. Detroit, Michigan, USA. (pp. pp. E38-E47). ASME. https://doi.org/10.2351/1.5059085
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