OFHC copper substrates, cleaned by laser ablation under argon and helium gas, were tested for solder wettability by 60Sn-40Pb using an area-of-spread method. The wettability of copper surfaces cleaned under both argon and helium gas was found to equal or exceed the wettability obtained on this surface in air using a standard RMA flux. The area of spread on copper substrates cleaned under helium was eight times larger than the area of spread of substrates cleaned under argon. The enhanced spreading observed on the substrates cleaned under helium gas was found to be due to surface roughness.
REFERENCES
1.
A. D.
Romig
, Jr., Y. A.
Chang
, J. J.
Stephens
, D. R.
Frear
, V.
Marcotte
, and C.
Lea
, Physical Metallurgy of Solder-Substrate Reactions, in Solder Mechanics-A State of the Art Assessment
, D. R.
Frear
, W. B.
Jones
, and K. R.
Kinsman
, Ed., The Minerals, Metals, and Materials Society
, (1991
), pp 29
2.
K.
Wolf
, “Printed Circuit Board Defluxing: Alternatives to Ozone Depleting Substances”, Proceedings of the First International Workshop on Solvent Substitution
, Phoenix AZ
, December
, 1990
, pp 127
3.
F. M.
Hosking
, “Reduction of Solvent Use Through Fluxless Soldering
”, Proceedings of the First International Workshop on Solvent Substitution, Phoenix AZ
, December
, 1990
, pp 31
4.
C. I. H.
Ashby
, “Laser-Driven Etching”, in Thin Film Processes II
, J. L.
Vossen
and W.
Kern
, Ed., Academic Press
, NY
, (1991
), pp 783
5.
H. C.
Peebles
, N. A.
Creager
, and D. E.
Peebles
, “Surface Cleaning by Laser Ablation
”, Proceedings of the First International Workshop on Solvent Substitution, Phoenix AZ
, December
, 1990
, pp 1
6.
U. R.
Evans
, The Corrosion and Oxidation of Metals: Science Principles and Practical Applications
, St. Martin’s Press Inc.
, NY
(1960
) pp 56
7.
R. J. Klein
Wassink
, Soldering in Electronics
. 2nd Ed., Electrochemical Publications Limited
, (1989
) pp 78
8.
W. F.
Chambers
, “Sandia TASK8: A Subroutined Electron Microprobe Automation System”, Sandia Report SAND 85-2037
, Albuquerque
, NM
, (1985
)9.
P. T.
Vianco
, F. M.
Hosking
, and D. R.
Frear
, “Lead Free Solders for Electronics Applications: Wetting Analysis”, Proceedings of the Electronics Materials Processing Congress
, Montreal
, Canada
, August
1991
10.
T. B
Massalski
, Binary Alloy Phase Diagrams, American Society for Metals
, (1986
) pp 965
11.
F. G.
Yost
and A. D.
Romig
, Jr., “Thermodynamics of Wetting by Liquid Metals
”, Met. Res. Soc. Symp. Proc
. 108
, (1988
) 385
12.
G. L.
Bailey
and H. C.
Watkins
, “The Flow of Liquid Metals on Solid Metal Surfaces and Its Relation to Soldering, Brazing, and Hot-Dip Coating
”, Journal of the Institute of Metals
80
, (1951
) 57
This content is only available via PDF.
© 1992 Laser Institute of America.
1992
Laser Institute of America
You do not currently have access to this content.