The present investigation is undertaken to assert the possibility of improving the surface properties of Ti-6Al-4V alloy through laser glazing, that is by generating a thin layer of refined microstructure on the surface. The studies have been carried out on a 5 KW CW CO2 laser and a 5 axis computer controlled work station. In order to freeze the lase parameters for area scanning, single lase trails have been created at 5 different scan velocities ranging between 200 inches per minutes (IPM) to 20 IPM at 2 differ nt lase power. Microstructure revealed two distinct zones on etching, the inner or the core structure consisting of remelted and solidified region, which is surrounded by a heat affected zone (HAZ), wher the temperature have crossed the β transus temperature. Microstructure of the remelted zone consists of a very fine equiaxed structure at the melt interface. Adjacent to the fine equiaxed grains, fine cells have been observed, which have grown, from favourably oriented fine equiaxed grains, antiparallel to the direction of heat flow. Towards the surface, secondary cells have been observed on the primary trunk. Microstructure in the HAZ showed the eptiaxially grown prior β grains containing martensite laths of α. The average microhardness in the HAZ has gone upto 440 VPN from the starting value of 320 VPN. Near the surface it is as high as 680 Kg/mm2.
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ICALEO '89: Proceedings of the Materials Processing Conference
October 15–20, 1989
Orlando, Florida, USA
ISBN:
978-0-912035-40-6
PROCEEDINGS PAPER
Laser glazing of Ti-6Al-4V alloy Available to Purchase
A. Bharti;
A. Bharti
*
Defence Metallurgical Research Laboratory
, P.O. Kanchanbagh, Hyderabad-500 258, India
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D. B. Goel
D. B. Goel
**
Department of Metallurgical Engineering, University of Roorkee
, ROORKEE 247667, INDIA
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Published Online:
October 01 1989
Citation
A. Bharti, D. B. Goel; October 15–20, 1989. "Laser glazing of Ti-6Al-4V alloy." Proceedings of the ICALEO '89: Proceedings of the Materials Processing Conference. ICALEO '89: Proceedings of the Materials Processing Conference. Orlando, Florida, USA. (pp. pp. 252-262). ASME. https://doi.org/10.2351/1.5058325
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