The process to utilize a pulsed 40 watt Neodymium YAG laser to microsolder ceramic chip capacitors and chip resistors to plastic printed circuit boards is described. A split laser beam is used to simultaneously solder reflow the chip component terminations. Control of the laser pulse width and energy per pulse prevents damage to the plastic printed circuit board materials and thermal shock to the brittle ceramic materials. The optics package and aperture system for microsoldering parts of varying dimensions is described.

Topics
Microelectronics, Printed circuit board, Lasers, Alloys, Ceramic materials
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© 1982 Laser Institute of America.
1982
Laser Institute of America
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