Ultra short pulse lasers pose new challenges on the beam deflection technologies. In this paper we present three recent developments that have an impact on the application of ultra short pulse lasers in industry. The three technologies include:
This scanning solution extends a laser scan system‘s working field by simultaneously controlling and moving a scan head and an XY-stage, thus delivering clear laser processing advantages, such as high processing throughput with an unprecedented level of accuracy. Process accuracy significantly improves, too, because a scan system‘s positioning error rises linearly with the image field size. The XL SCAN solution‘s combined motions at higher accuracy will use a smaller image field, thereby reducing this error.
This micromachining sub system enables laser micro processing and drilling of flexibly variable geometries as well as laser cutting and structuring. Designed for ultra-short-pulse (USP) lasers, bore holes and cutting edges are exceptionally clean cut and don’t require post-processing.
The achieved identical dynamics of all three axes now opens up entirely new processing strategies and opportunities. Furthermore, this new technology uses only reflective optical components. This allows using different wavelengths without dispersion and reduces thermal lens effects at power laser applications.