In recent years, laser micromachining of semiconductor materials such as silicon and sapphire has attracted more and more attention. High power Diode Pumped Solid State (DPSS) lasers have been gained wider application in microelectronics, flat panel display, and solar cell manufacturing industries because it can obtain smaller feature sizes, higher throughput and lower costs. The works on typical applications of 355nm DPSS UV laser micro-processing new energy source materials have been introduced in this paper, including microprocessing carried out on fluorine-doped tin oxide (FTO) thin film and polyimide membrane to investigate the etching accuracy and depth with different laser processing modes and parameters in order to meet the technologic requirement of laser micromachining. Another important work introduced in this paper is laser selectively sintering TiO2 films for dye-sensitized solar cells (DSCs). The effects of parameters (average power, repetition rate, scanning speed and scan spacing) on the on the micro-processing quality and precision have been investigated and analysed. The incident photon-to-electron conversion efficiency and the current-voltage characteristic of the DSC were also determined.
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ICALEO 2013: 32nd International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing
October 6–10, 2013
Miami, Florida, USA
ISBN:
978-0-912035-98-7
PROCEEDINGS PAPER
Silicon laser micro-processing of new energy source materials Available to Purchase
Huan Yang;
Huan Yang
Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology
, Wuhan, Hubei, 430074, China
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Jun Duan;
Jun Duan
Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology
, Wuhan, Hubei, 430074, China
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Xiaoyan Zeng;
Xiaoyan Zeng
Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology
, Wuhan, Hubei, 430074, China
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Leimin Deng;
Leimin Deng
Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology
, Wuhan, Hubei, 430074, China
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Fei Zhang
Fei Zhang
Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology
, Wuhan, Hubei, 430074, China
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Published Online:
October 01 2013
Citation
Huan Yang, Jun Duan, Xiaoyan Zeng, Leimin Deng, Fei Zhang; October 6–10, 2013. "Silicon laser micro-processing of new energy source materials." Proceedings of the ICALEO 2013: 32nd International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. ICALEO 2013: 32nd International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Miami, Florida, USA. (pp. pp. 776-782). ASME. https://doi.org/10.2351/1.5062965
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